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Diode lead wire sealing device that can realize uniform gluing

A sealing device and diode technology, which is applied to the surface coating liquid device, electrical components, semiconductor/solid device manufacturing, etc., can solve the problems of uniformity, bending and other problems, and achieve the guarantee and improvement of the uniformity of the glue Effect of contact area and improvement of contact time

Active Publication Date: 2017-04-12
定远县润声电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the existing sealing process, the lead wires are repeatedly contacted between the sealing teeth on the sealing rack, so that the glue on the sealing teeth can be glued to the leads; however, in During the above-mentioned sealing process, the leads can only pass through the upper end surface of the sealing tooth, and complete the contact with the glue at this position. When the glue on the upper surface of the sealing tooth is not enough to realize multiple leads for gluing, The uniformity of the glue on each lead wire will be affected; at the same time, in the actual setting process, it is difficult for the lead wire to be flush with the upper end surface of the sealing tooth, and when the lead wire is too high, it is difficult for the lead wire to touch enough Glue, when the lead wire is too low, its repeated friction with the sealing teeth will cause it to bend

Method used

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  • Diode lead wire sealing device that can realize uniform gluing
  • Diode lead wire sealing device that can realize uniform gluing
  • Diode lead wire sealing device that can realize uniform gluing

Examples

Experimental program
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Effect test

Embodiment 1

[0023] Such as figure 1 A diode lead wire sealing device that can achieve uniform gluing is shown, which includes a support platform 1, a transmission chain 2 for transporting diodes is arranged on the support platform 1, and a sealing device for sealing the diode leads. The rubber rack 3 includes a plurality of upwardly extending sealing teeth 31, and the sealing rack 3 extends parallel to the transmission chain 2; the sealing rack 3 is provided with a glue port 4, which communicates with the glue groove 5 provided in the support platform 1 .

[0024] Such as figure 1 and figure 2 As shown, the diode lead wire sealing device that can realize uniform gluing is provided with a lead wire placement end block 6, which is fixed on the transmission chain 2, and a plurality of lead wires parallel to each other are arranged in the lead wire placement end block 6 Place the hole 7, the axis of the lead wire placement hole 7 extends perpendicular to the transmission chain 2; the lead...

Embodiment 2

[0033] As an improvement of the present invention, the diode lead wire sealing device capable of uniform gluing is provided with two lead support end blocks 6 , which are respectively located on both sides of the sealing rack 3 . With the above design, the diode lead wires can be respectively supported by the lead wire support end blocks located on both sides of the sealing rack, so that the supporting effect can be further improved.

[0034] The remaining features and advantages of this embodiment are the same as those of Embodiment 1.

Embodiment 3

[0036] As an improvement of the present invention, the vertical distance between the gluing port 4 and the gluing rack 3 is 0.2 cm, which can further ensure the connection between the lead wire of the diode and the gluing rack, and the gluing port. fit.

[0037] The remaining features and advantages of this embodiment are the same as those of Embodiment 2.

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PUM

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Abstract

The invention discloses a diode lead sizing sealing device capable of achieving uniform sizing. The device comprises a supporting platform. A transmission chain and a sizing sealing rack are arranged on the supporting platform. The sizing sealing rack comprises a plurality of sizing sealing teeth. Gluing ports are formed above the sizing sealing rack and communicated into a sizing groove. Lead placement end blocks are arranged in the diode lead sizing sealing device capable of achieving uniform sizing and fixedly arranged on the transmission chain. A plurality of lead placement holes are formed in each lead placement end block. In the sizing sealing rack, one gluing port is formed between every two adjacent sizing sealing teeth, and each gluing port is internally provided with at least two gluing port holes. By the adoption of the technical scheme, according to the diode lead sizing sealing device capable of achieving uniform sizing, the uniformity of sizing fluid at the diode lead sizing sealing position is effectively ensured by optimizing the contact time and area between the lead and the sizing fluid.

Description

technical field [0001] The invention relates to processing equipment for electronic components, in particular to a diode lead wire sealing device capable of uniform gluing. Background technique [0002] The leads of the diode need to be sealed with glue so that they can be prepared into a complete diode. In the existing sealing process, the lead wires are repeatedly contacted between multiple sealing teeth on the sealing rack, so that the glue on the sealing teeth can be glued to the leads; however, in During the above-mentioned sealing process, the leads can only pass through the upper end surface of the sealing tooth, and complete contact with the glue at this position. When the glue on the upper surface of the sealing tooth is not enough to realize multiple leads for gluing, The uniformity of the glue on each lead wire will be affected; at the same time, in the actual setting process, it is difficult for the lead wire to be flush with the upper end surface of the sealing...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05C5/00B05C13/02H01L21/67
Inventor 蒋元昌蒋有新
Owner 定远县润声电子有限公司