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Radiation heat exchange board assembly

A technology of radiation heat exchange and plate assembly, applied in the field of radiant plate heat exchange, can solve the problems of easy deformation, high cost, heavy PVC crystal plate, etc., and achieve the effect of reducing quality, reducing cost, and remarkable radiation heat exchange effect

Inactive Publication Date: 2015-10-21
GREE ELECTRIC APPLIANCES INC OF ZHUHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In the prior art, PVC (Polyvinyl chloride, polyvinyl chloride) crystal plate is usually used as the heat equalizing material of the non-metallic heat conduction layer, so as to make the surface temperature of the metal radiant plate more uniform, but the quality of the PVC crystal plate is heavy and the cost is high , and easily deformed with temperature changes

Method used

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  • Radiation heat exchange board assembly
  • Radiation heat exchange board assembly
  • Radiation heat exchange board assembly

Examples

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Embodiment Construction

[0033] The core of the present invention is to provide a radiation heat exchange plate assembly to reduce cost, reduce weight and avoid deformation with temperature changes.

[0034] Hereinafter, an embodiment will be described with reference to the drawings. In addition, the examples shown below do not limit the content of the invention described in the claims in any way. In addition, all the contents of the configurations shown in the following embodiments are not limited to be essential to the solution of the invention described in the claims.

[0035] see figure 1 with figure 2 , figure 1 An exploded view of the radiation heat exchange plate assembly provided by the embodiment of the present invention; figure 2 It is a sectional view of the radiation heat exchange plate assembly provided by the embodiment of the present invention.

[0036] The radiation heat exchange plate assembly provided in the embodiment of the present invention includes a decorative panel 106 ,...

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Abstract

The embodiment of the invention discloses a radiation heat exchange board assembly which comprises a veneer and a heat exchange component and further comprises supporting pieces arranged between the veneer and the heat exchange component. A hollow layer is formed between the veneer and the heat exchange component through the supporting pieces, or a heat exchange base of the heat exchange component is of a box-type structure with a hollow layer. According to the radiation heat exchange board assembly, the hollow layer is formed between the veneer and the heat exchange component, or the hollow layer is directly formed in the heat exchange base of the heat exchange component. The hollow layer replaces a nonmetal heat conducting layer in the prior art, the infrared transmittance of the hollow layer is higher than that of a PVC crystal board, and the radiation heat exchange effect is more obvious; the PVC material is omitted, cost can be lowered, the mass can be reduced, and deformation cannot happen along with changing of temperature.

Description

technical field [0001] The invention relates to the technical field of radiant plate heat exchange, more specifically, to a radiant heat exchange plate assembly. Background technique [0002] Most air conditioning systems in the prior art use air as the heat transfer medium. However, the energy consumption of the air conditioning system is high, the human comfort is poor, and it is not conducive to the removal of pollutants in the indoor air, so the radiant plate heat exchange technology came into being. [0003] The existing radiant heat exchange plate assembly includes a metal radiant plate (decorative plate), a heat exchange component and an outer cover. A transparent non-metallic heat conduction layer is arranged between the metal radiation plate and the heat exchange component, and the upper and lower sides of the nonmetal heat conduction layer are respectively in contact with the heat exchange component and the metal radiation plate. The heat exchange components are ...

Claims

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Application Information

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IPC IPC(8): F24F5/00F24F13/30
CPCF24F5/0089F24F13/30
Inventor 吴一梅林海佳黄昌成安建克王思
Owner GREE ELECTRIC APPLIANCES INC OF ZHUHAI
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