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Grinding Machine

A grinding and grinding wheel technology, which is applied in the direction of abrasive surface adjustment devices, grinding machine parts, grinding/polishing equipment, etc., can solve the problems of increased cost, multiple dressing plates, and reduced continuous processing

Inactive Publication Date: 2015-10-28
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the case of pushing the trim plate for dressing, the trim plate needs to be replaced periodically
Grinding of the grinding stone is stopped during this replacement operation, and there is a problem that continuous processing performance is reduced
In addition, many trimming plates are required, and there is a problem of cost increase

Method used

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Embodiment Construction

[0013] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. figure 1 It is a front schematic view of the grinding apparatus of embodiment.

[0014] Such as figure 1 As shown, the grinding apparatus 1 has a holding table 3 and a grinding unit 4 , and is configured so that the workpiece W held by the holding table 3 is ground by the grinding unit 4 . In holding station 3's figure 1 The middle right area is provided with an ultrasonic cleaning nozzle 5 .

[0015] As the workpiece W of the grinding apparatus 1, a plate-shaped workpiece composed of a hard difficult-to-cut member can be used. The workpiece W is made of materials such as borosilicate glass, semiconductor wafer, sapphire, and silicon carbide (SiC).

[0016] The holding table 3 has a disc shape, and a holding surface 3 a for suction-holding the workpiece W is provided on the upper surface thereof. The holding surface 3 a is made of, for example, a porous cer...

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PUM

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Abstract

The invention provides a grinding machine, which has an ultrasonic cleaning jet (5). The ultrasonic cleaning jet (5) comprises a jet body (52), from which a cleaning solution (51) applied to a grinding wheel (41) is ejected; a cleaning-solution supplying part (51) supplying the cleaning solution to the jet body; an ultrasonic vibrator (55) applying an ultrasonic wave to the cleaning solution supplied by the cleaning-solution supplying part; and a power supply unit (56) applying an alternating current to the ultrasonic vibrator. The ultrasonic cleaning jet is configured in such a way that the cleaning solution applied with the ultrasonic wave is ejected from the ultrasonic cleaning jet and is applied to a grinding face (42a) of a grinding grindstrone (42) of a ground object (W). The vibrational frequency of the ultrasonic vibrator is set in a range of 450 kHz-1.0 MHz.

Description

technical field [0001] The present invention relates to a grinding device capable of grinding a workpiece by bringing a grinding stone into contact with it. Background technique [0002] Various workpieces such as semiconductor wafers, sapphire, and SiC are ground to a predetermined thickness by a grinding device, and then divided into devices. The grinding device grinds the workpiece by bringing the grinding surface of the rotating grinding stone into contact with the workpiece. If this grinding is performed, clogging of the abrasive grain pores is likely to occur on the grinding surface, and the clogging of the abrasive grain pores reduces the grinding ability, so that the grinding surface needs to be frequently reconditioned. In addition, in the case of grinding difficult-to-cut parts such as sapphire or SiC, etc., in the case of abnormal wear caused by porosity damage on the grinding stone, the dressing plate is pushed against the grinding wheel during the grinding proc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B53/007
CPCB24B53/007
Inventor 井上雄贵渡边真也禹俊洙
Owner DISCO CORP