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LED package method

A technology of LED packaging and LED chips, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of low LED production efficiency, troublesome fluorescent glue molding process, etc., and achieve the effect of good hot meltability and convenient storage.

Inactive Publication Date: 2015-10-28
HONGLI ZHIHUI GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The molding process of these fluorescent glues is cumbersome, which is the main reason for the low production efficiency of LEDs.

Method used

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Embodiment 1

[0028] The invention discloses an LED packaging method. The LED is changed into a chip-level packaged white light LED. The bottom of the LED chip is provided with electrodes, and the four sides and the top surface of the LED are light-emitting surfaces, and blue light is used to excite phosphor powder to emit white light. Such as figure 1 As shown, the encapsulation method of LED comprises the following steps:

[0029] (1) Multiple LED chips 3 are distributed and fixed on the carrier board 1 in the form of a rectangular array. The carrier board 1 is a glass plate. The specific fixing method:

[0030] (1.1) First, stick a layer of fixed film 2 on the carrier plate 1. The fixed film 2 in this embodiment is a UV double-sided tape film;

[0031] (1.2) Then fix the bottom of the LED chip 3 on the UV double-sided tape film. By irradiating the carrier plate 1 with ultraviolet rays, the UV double-sided tape film can be separated from the LED chip 3; in order to cut the LED chip 3 in ...

Embodiment 2

[0041] An LED packaging method, the LED is a chip-level packaged white light LED, the bottom of the LED chip 3 is provided with an electrode 6, the four sides and the top surface of the LED are light-emitting surfaces, and the phosphor is excited by blue light to emit white light. Such as figure 1 As shown, the encapsulation method of LED comprises the following steps:

[0042] (1) Multiple LED chips 3 are distributed and fixed on the carrier board 1 in the form of a circular array, and the carrier board 1 is a glass plate. The specific fixing method:

[0043] (1.1) First, stick a layer of fixed film 2 on the carrier plate 1. The fixed film 2 in this embodiment is a thermal separation tape film;

[0044] (1.2) Then fix the bottom of the LED chip 3 on the heat-separation tape film, and by using the heating carrier 1, the heat-separation tape film can be separated from the LED chip 3; in order to cut the LED chip 3 in the following process, adjacent LED chips 3 There is a gap ...

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Abstract

The invention provides an LED package method. The method comprises the steps that (1) multiple LED chips are distributed and fixed on a carrier plate in an array; (2) a hot-melt adhesive block doped with phosphor is placed at the top of the LED chip array; (3) the hot-melt adhesives block is heated, and at the same time the hot-melt adhesives block is pressed from the top until the LED chips can be pressed into the hot-melt adhesive, so that the hot-melt adhesive block completely wraps reflective surfaces on the side and the top of the LED chips; and (4) the LED chip array is cut to acquire LEDs which are individually packaged. The hot-melt adhesive doped with the phosphor can be preformed. At room temperature, the hot-melt adhesive is solid and is easy to store. When the hot-melt adhesive needs to be used, the hot-melt adhesive is cut into a right size. The hot-melt adhesive is heated, and the softened hot-melt adhesive covers the light emitting surfaces of the LED chips. After the hot-melt adhesive is cooled, the hot-melt adhesive and the surfaces of the LED chips are firmly bonded. A fluorescent adhesive layer is formed on the light emitting surfaces of the LED chips, and the process is easy and fast.

Description

technical field [0001] The invention relates to LED packaging, in particular to a packaging method for chip-level packaging of white light LEDs. Background technique [0002] A new type of chip-scale package LED (CSP LED; Chip Scale LED) based on flip chip [0003] Package LED) is equipped with electrodes on the bottom of the chip, and the colloid is directly packaged on the upper surface and side of the chip, so that the electrodes on the bottom are exposed. Since this packaging structure has no bracket or substrate, the packaging cost can be reduced. Existing chip-scale packaged LEDs usually emit light from five sides, that is, both the top surface and the four sides of the LED can emit light, and the packaging process of this kind of LED is relatively simple. With the improvement of people's requirements for the angle and consistency of light output of products, the current chip-scale package LED structure can no longer meet people's needs, and people are eager for the e...

Claims

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Application Information

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IPC IPC(8): H01L33/52H01L33/54
CPCH01L33/52H01L33/54
Inventor 熊毅杜金晟郭生树朱富斌李坤锥
Owner HONGLI ZHIHUI GRP CO LTD