Unlock instant, AI-driven research and patent intelligence for your innovation.

Flexible Circuit Film Structure

A thin-film structure and flexible circuit technology, which is applied to printed circuit components and other directions, can solve the problems of prolonged manufacturing time, time-consuming and labor-intensive, and achieve the effect of reducing alignment errors

Active Publication Date: 2018-04-06
CHIPMOS TECH INC
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After the flexible circuit board is folded back, the alignment of the above-mentioned two-phase bonded area has its precision requirements. Generally speaking, the current flexible circuit board base material does not set the corresponding drawing definition, only After the flexible circuit board is folded back, it is possible to use a tool microscope to measure whether the accuracy meets the specifications, but it cannot be quickly judged by visual inspection when it is attached, so the overall manufacturing time is prolonged, and if the flexible circuit board is checked out After folding, the precision specification is exceeded, and heavy work is required to correct it, which is extremely time-consuming and labor-intensive

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Flexible Circuit Film Structure
  • Flexible Circuit Film Structure
  • Flexible Circuit Film Structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0039] figure 1 It is a schematic diagram of a flexible circuit film structure according to an embodiment of the present invention. figure 2 yes figure 1 A schematic diagram of the flexible substrate after being folded along the fold line. image 3 yes figure 2 The cross-sectional view of the flexible substrate along the line I-I. Please refer to Figure 1 to Figure 3 , in this embodiment, the flexible circuit thin film structure 100 includes a flexible substrate 110 , an element 120 and an alignment pattern 130 .

[0040] The flexible substrate 110 has a first region 111 and a second region 112 adjacent to the first region 111 , and the first region 111 has at least two edges L. Generally speaking, the material of the flexible substrate 110 may include polyethylene terephthalate (polyethyleneterephthalate, PET), polyimide (Polyimide, PI), polyether (polyethersulfone, PES), polycarbonate (polycarbonate) , PC) or other suitable flexible materials. Specifically, the fle...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a flexible circuit film structure. The structure comprises a flexible substrate, an element and at least one corresponding pattern. A flexible substrate having a first region and a second region adjacent the first region, and the first region has at least two edges. The element is disposed on the flexible substrate and is located on one of them first or second zone. The corresponding pattern is on a flexible substrate. When the first region along the fold line and fold in the second zone is at least partially stacked timely, at least two edges of the first zone is located on the orthographic projection of the second region of the bit pattern and cut flush.

Description

technical field [0001] The present invention relates to a circuit film structure, and in particular to a flexible circuit film structure. Background technique [0002] With the high development of electronic technology, electronic products are constantly being introduced. As far as the current situation is concerned, products such as information, communication and consumer electronics, the so-called 3C products, have become one of the fastest growing items in the electronic industry. Among them, the printed circuit board (Printed Circuit Board) can be used as a medium for the connection relationship between multiple electronic components in these 3C products, so as to integrate the functions corresponding to each electronic component. Take the flexible printed circuit board as an example, it is suitable for bending and is quite light and thin, and can adapt to the internal configuration space of these 3C products to adjust various types, so it is widely used Among these 3C ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02
Inventor 陈宗谦陈崇龙
Owner CHIPMOS TECH INC