Sealing sheet, method for producing semiconductor device, and substrate provided with sealing sheet
A sealing sheet, semiconductor technology, applied in the direction of semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as difficulty in adjusting the injection position and injection amount
Inactive Publication Date: 2015-11-18
NITTO DENKO CORP
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
Liquid sealing resins are widely used as such sealing resins, but liquid sealing resins are difficult to adjust the injection position and injection amount, or cannot sufficiently fill the periphery of bumps that have been narrowed in pitch, resulting in voids
Method used
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Embodiment 1～4 and comparative example 1～3
[0146] (production of sealing sheet)
[0147] The following components were dissolved in methyl ethyl ketone at the ratios shown in Table 1 to prepare a solution of an adhesive composition having a solid content concentration of 23.6 to 60.6% by weight.
[0148] Epoxy resin 1 (liquid at 25°C): trade name "Epikote 828", manufactured by JER Corporation
[0149] Epoxy resin 2: trade name "Epikote 1004", manufactured by JER Corporation
[0150] Phenolic resin 1: trade name "MilexXLC-4L", manufactured by Mitsui Chemicals, Ltd.
[0151] Phenolic resin 2 (liquid at 25°C): trade name "MEH-8005", manufactured by Meiwa Kasei Co., Ltd.
[0152] Elastomer 1: Acrylate-based polymer mainly composed of ethyl acrylate-methyl methacrylate (trade name "PagocloneW-197CM", manufactured by Negami Industry Co., Ltd.)
[0153] Elastomer 2: Acrylate-based polymer mainly composed of butyl acrylate-acrylonitrile (trade name "SG-P3", manufactured by Nagase Chemtex Co., Ltd.)
[0154] Filler: spheric...
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Abstract
Provided are: a sealing sheet that can suppress the occurrence of voids by means of favorable embedding properties into the protrusions / recesses of an adherend or semiconductor element, and has favorable workability from before to after being pasted to an adherend; a method for producing a semiconductor device using the sealing sheet; and a substrate to which the sealing sheet has been pasted. The sealing sheet is provided with a substrate and an underfill material that is provided on the sealing sheet and has the following characteristics: a 90° peeling strength from the substrate of 1-50 mN / 20 mm inclusive, a rupture elongation at 25°C of at least 10%, a lowest viscosity at 40°C or higher and less than 100°C of no greater than 20,000 Pa·s, and a lowest viscosity between 100°C and 200°C inclusive of at least 100 Pa·s.
Description
technical field [0001] The present invention relates to a sealing sheet, a method for manufacturing a semiconductor device, and a substrate with the sealing sheet. Background technique [0002] In recent years, the demand for high-density mounting due to miniaturization and thinning of electronic equipment has increased rapidly. In response to this demand, among semiconductor packages, a surface mount type suitable for high-density mounting has become the mainstream instead of the conventional through-hole type. Among them, a flip-chip mounting technology in which a semiconductor chip is electrically connected to a substrate via protrusion-shaped electrodes (terminals) formed on the surface of the semiconductor chip is being developed. [0003] During surface mounting, the space between the semiconductor element and the substrate is filled with sealing resin in order to protect the surface of the semiconductor element and ensure connection reliability between the semiconduc...
Claims
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IPC IPC(8): H01L21/60B32B7/04H01L23/29H01L23/31
CPCH01L21/563B32B27/08B32B27/36B32B27/38B32B27/42B32B2457/14H01L23/295H01L24/11H01L24/13H01L24/14H01L24/16H01L24/27H01L24/29H01L24/32H01L24/73H01L24/81H01L24/83H01L24/92H01L2224/11332H01L2224/13025H01L2224/13111H01L2224/13144H01L2224/13147H01L2224/14181H01L2224/16145H01L2224/16225H01L2224/16227H01L2224/16245H01L2224/27003H01L2224/271H01L2224/27334H01L2224/2744H01L2224/2919H01L2224/2929H01L2224/293H01L2224/29311H01L2224/29316H01L2224/29318H01L2224/29324H01L2224/29339H01L2224/29344H01L2224/29347H01L2224/29355H01L2224/29364H01L2224/29371H01L2224/29387H01L2224/2939H01L2224/29393H01L2224/32145H01L2224/32225H01L2224/32245H01L2224/73204H01L2224/81191H01L2224/81204H01L2224/81815H01L2224/83191H01L2224/83192H01L2224/83204H01L2224/83862H01L2224/8388H01L2224/83948H01L2224/9211H01L2224/92125H01L2924/15311H01L2924/15787H01L2224/81011H01L2224/83885B32B5/02B32B5/24B32B7/06B32B9/005B32B9/04B32B9/045B32B15/04B32B15/08B32B23/08B32B27/10B32B27/12B32B27/16B32B27/18B32B27/20B32B27/281B32B27/283B32B27/286B32B27/304B32B27/306B32B27/308B32B27/32B32B27/322B32B27/34B32B27/365B32B27/40B32B29/002B32B29/005B32B29/02B32B29/06B32B2255/02B32B2255/06B32B2255/10B32B2255/12B32B2255/205B32B2262/101B32B2307/50B32B2307/514B32B2307/748B32B2457/00B32B2457/08B32B7/12B32B2405/00H01L2924/01006H01L2924/05442H01L2924/00014H01L2924/014H01L2924/01082H01L2924/01047H01L2924/01029H01L2924/0103H01L2924/01083H01L2224/81H01L2224/83H01L2924/00H01L2924/0635H01L2924/0665H01L2924/066H01L2924/095H01L2224/8185
Inventor 盛田浩介高本尚英
Owner NITTO DENKO CORP