Inverted LED chip test equipment and test method thereof

A technology for testing LED chips and chips, applied in the field of light sources, can solve the problems of optical test results error of flip-chip LED chips, affecting the test effect of flip-chip LED chips, etc., so as to save production cost and time, reduce workload, and accurately test results. Effect

Inactive Publication Date: 2015-11-25
FOSHAN NATIONSTAR SEMICON
View PDF6 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Based on this, regardless of whether the film is a blue film or a white film, the optical test results of the flip-chip LED chip will cause errors due to the different transmittance of the film itself, which will affect the test effect of the flip-chip LED chip.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Inverted LED chip test equipment and test method thereof
  • Inverted LED chip test equipment and test method thereof
  • Inverted LED chip test equipment and test method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0050] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0051] An embodiment of the present invention provides a testing device for a flip-chip LED chip, which is used for testing the electrical and optical properties of the flip-chip LED chip.

[0052] The flip-chip LED chip in this embodiment is the same as the existing flip-chip LED chip, such as including a positive electrode, a P-type gallium nitride layer, an active layer, an N-type gallium nitride layer, a negative electrode and a transparent substrate, etc. ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides inverted LED chip test equipment and a test method thereof. The inverted LED chip test equipment comprises a chip transferring device, a test worktable, a chip testing device and a chip fixing device, wherein the test worktable is made of transparent materials; the chip transferring device is used for transferring inverted LED chips adhering to a film to the test worktable in sequence; the chip test device is used for testing the inverted LED chips on the test worktable and classifying the inverted LED chips according to the test result; the chip fixing device is used for fixing the inverted LED chips in a classifying mode according to the classification result. According to the inverted LED chip test equipment and the test method thereof, the inverted LED chips adhering to the film are transferred to the test worktable through the chip transferring device to be tested; as the test worktable is made of the transparent materials, errors of the optical test result of the inverted LED chips can be reduced, and a relatively accurate test result is obtained; moreover, the workload for subsequent treatment of the inverted LED chips can be lightened, the manufacturing cost is reduced, and the manufacturing time is shortened.

Description

technical field [0001] The invention relates to the technical field of light sources, and more specifically, to a flip-chip LED chip testing device and a testing method thereof. Background technique [0002] Existing LED (Light Emitting Diode, light emitting diode) chips include front-mount LED chips and flip-chip LED chips. Since the flip-chip LED chip has the advantages of high light extraction rate, low voltage, and good heat dissipation function, it has been widely used in various lighting devices. [0003] Before putting flip-chip LED chips into use, their optical properties need to be tested. The existing test method is to adhere the back side of the flip-chip LED chip on the film, and then fix the flip-chip LED chip with the film on the test bench for testing. [0004] However, since the flip-chip LED chip emits light from the back, when testing, the light emitted from the flip-chip LED chip must pass through the film. Based on this, regardless of whether the film ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B07C5/342B07C5/36B07C5/38
Inventor 王丹宇
Owner FOSHAN NATIONSTAR SEMICON
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products