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Gum and processing mold set, and processing technique thereof

A processing technology and mold set technology, applied in the field of adhesive, can solve the problems affecting the function and life of electronic products, and achieve the effects of good production stability, high dimensional accuracy, and good antifouling effect.

Active Publication Date: 2015-11-25
DONGGUAN TARRY ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the flexible circuit board falls off or separates from the adhered parts, it will seriously affect the function and life of the electronic product

Method used

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  • Gum and processing mold set, and processing technique thereof
  • Gum and processing mold set, and processing technique thereof
  • Gum and processing mold set, and processing technique thereof

Examples

Experimental program
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Embodiment Construction

[0043] In the following, the adhesive and processing mold set of the present invention and its processing technology will be further described in detail with reference to the accompanying drawings:

[0044] Such as figure 1 , 2 As shown, a back glue includes a release film 3 and a release paper 5, and a double-sided adhesive 4 arranged between the release film 3 and the release paper 5; and is divided into a glue area 1 and a glue free area 2. , The double-sided adhesive tape 4 with the adhesive area 1 in a rectangular shape removes a quarter part 11 on the upper right side and a triangular protrusion part 12 at the lower right side; the adhesive-free area 2 is covered by a release film 3 After the glue area 1, there is a glue-free extension 21 on the upper left side; the release film 3 is covered with the glue area 1, the edge of which is larger than the glue area 1.

[0045] Preferably, the corners of the glued area 1 and the glueless area 2 are rounded to make the edges smooth. ...

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Abstract

The invention discloses a gum and a processing mold set, and a processing technique thereof. The gum comprises a release film, release paper and a double-faced adhesive tape arranged between the release film and release paper, and is divided into an adhesive region and a nonadhesive region. In order to obtain the gum product, the mold set for mold cutting processing is arranged, and comprises a mold 1, a mold 2 and a mold 3. The processing technique is implemented by utilizing a flat knife mold cutting device or circular knife mold cutting device and the gum processed by the mold set. The mold set for processing the gum is applicable to the fields of flexible circuit board assembly and the like, has corresponding shape with the circuit board bonding part, has high dimensional accuracy, and can implement large-scale automatic production.

Description

Technical field [0001] The invention relates to a back glue, in particular to a back glue and a processing die set used in combination with a flexible circuit board and a plastic box hardware and its processing technology. Background technique [0002] Flexible printed circuit board (FPC) is a printed circuit with high reliability and excellent flexibility made of polyester film or polyimide as the base material. Because of its small size, light weight and thin thickness, it has become more and more popular among electronic designers and is widely used in various portable and other electronic products such as mobile phones and notebook computers. At present, in the flexible circuit board assembly industry, PET substrate double-sided pressure-sensitive tape, non-woven substrate double-sided tape, and substrate-free pure adhesive film pressure-sensitive adhesive products are being used in large numbers. Each type of tape product has its own advantages and shortcomings. Flexible ci...

Claims

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Application Information

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IPC IPC(8): C09J7/00
Inventor 熊四化李清平宋科强
Owner DONGGUAN TARRY ELECTRONICS