Metallic packaging structurized chip-type tantalum capacitor and packaging method thereof
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- ZHUZHOU HONGDA ELECTRONICS
- Publication Date
- 2015-11-25
Smart Images
Figure 1
Abstract
Description
technical field
[0001] The invention relates to an electronic component and a manufacturing method thereof, in particular to a chip tantalum capacitor with a metal package structure and a manufacturing method thereof, so as to solve the problem of airtightness of resin packaged products, improve its reliability, and maintain a chip appearance at the same time Designed for ease of installation and use. It belongs to the technical field of making electronic components. Background technique:
[0002] Chip solid tantalum capacitor is a polar component. In microelectronic circuits, the unidirectional conductivity of its dielectric layer can be used for filtering to filter out or reduce the amplitude of the remaining AC ripple signal in the DC signal. , The chip solid tantalum capacitor is characterized by long life, high temperature resistance, high accuracy, excellent high-frequency harmonic filtering performance, and various forms, excellent volume efficiency, has its unique ...