Metallic packaging structurized chip-type tantalum capacitor and packaging method thereof

A technology of metal encapsulation and tantalum capacitors, applied in the direction of capacitor shell/package, capacitors, electrolytic capacitors, etc., to ensure the effect of welding sealing
CN105097288AActive Publication Date: 2015-11-25ZHUZHOU HONGDA ELECTRONICS

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
ZHUZHOU HONGDA ELECTRONICS
Publication Date
2015-11-25

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Abstract

The invention relates to a metallic packaging structurized chip-type tantalum capacitor and a packaging method thereof. With the adoption of a metallic packaging structure, a layer of bonding conductive glue wraps outside a tantalum chip, and then a layer of metal shell wraps outside the bonding conductive glue; and meanwhile, one head of the tantalum chip is connected with a tantalum filament, and the tantalum filament is led out of the metal shell through a tantalum filament leading-out line to form the metallic packaging structurized chip-type tantalum capacitor. The tantalum filament and the tantalum filament leading-out line are connected together by welding, a welding point of the tantalum filament and the tantalum filament leading-out line is arranged on the inner surface of the metal shell, an insulation block sleeves outside the welding point of the tantalum filament and the tantalum filament leading-out line, the bonding conductive glue wraps between the insulation block and the tantalum chip and also wraps outside the insulation block, and thus, the spaces among the tantalum chip, the tantalum filament, the tantalum filament leading-out line and the shell are relatively fixed.
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Description

technical field

[0001] The invention relates to an electronic component and a manufacturing method thereof, in particular to a chip tantalum capacitor with a metal package structure and a manufacturing method thereof, so as to solve the problem of airtightness of resin packaged products, improve its reliability, and maintain a chip appearance at the same time Designed for ease of installation and use. It belongs to the technical field of making electronic components. Background technique:

[0002] Chip solid tantalum capacitor is a polar component. In microelectronic circuits, the unidirectional conductivity of its dielectric layer can be used for filtering to filter out or reduce the amplitude of the remaining AC ripple signal in the DC signal. , The chip solid tantalum capacitor is characterized by long life, high temperature resistance, high accuracy, excellent high-frequency harmonic filtering performance, and various forms, excellent volume efficiency, has its unique ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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