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Metallic packaging structurized chip-type tantalum capacitor and packaging method thereof

A technology of metal encapsulation and tantalum capacitors, applied in the direction of capacitor shell/package, capacitors, electrolytic capacitors, etc., to ensure the effect of welding sealing

Active Publication Date: 2015-11-25
ZHUZHOU HONGDA ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The purpose of this invention is to propose a new chip solid tantalum capacitor and its manufacturing method for the shortcomings of the existing chip solid tantalum capacitor resin packaging method The chip solid tantalum capacitor and its manufacturing method can effectively solve the problem that the chip solid tantalum capacitor is easily damaged by the intrusion of moisture or corrosive gas and liquid in harsh environments such as high temperature and high humidity. The problem of product performance deterioration or even failure

Method used

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  • Metallic packaging structurized chip-type tantalum capacitor and packaging method thereof

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Experimental program
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Effect test

Embodiment 1

[0032] by attaching figure 1 It can be seen that the present invention relates to a chip tantalum capacitor with a metal package structure, which adopts a metal package structure, wraps a layer of bonding conductive adhesive 1 on the outside of the tantalum chip 2, and then wraps a layer of metal shell 11 on the outside of the bonding conductive adhesive 1 At the same time, a tantalum wire 3 is connected to one end of the tantalum chip 2, and the tantalum wire 3 is led out of the metal shell 11 through the tantalum wire lead-out wire 5, forming a chip tantalum capacitor with a metal package structure.

[0033] The tantalum wire 3 and the tantalum wire lead-out wire 5 are connected by welding, and the welding point 4 of the tantalum wire 3 and the tantalum wire lead-out wire 5 is located on the inner surface of the metal shell 11, and the tantalum wire 3 and the tantalum wire lead-out wire 5 The welding point 4 is covered with an insulating block 12, between the insulating blo...

Embodiment 2

[0038] The structure of the second embodiment is basically the same as that of the first embodiment, except that an "L"-shaped positive pole pin 13 and an "L"-shaped negative pole pin 14 are respectively connected to the cylinder body and the cover plate of the metal casing; wherein, The "L"-shaped positive pin 13 is connected to the tantalum wire lead-out line protruding from the cover plate, and the "L"-shaped negative pin 14 is connected to the bottom of the cylinder of the metal casing, and the positive pin and the negative pin The two toes are arranged opposite to each other, which is convenient for connection with the outside.

Embodiment 3

[0040] The structure of the third embodiment is basically the same as that of the second embodiment, except that an "L"-shaped insulating sheet 10 is set on the tantalum wire lead-out line between the positive pin and the cover plate, and the insulating sheet 10 is "L"-shaped. The top of the folded edge extends between the negative pin and the barrel of the metal casing to prevent short-circuiting of the positive and negative poles.

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Abstract

The invention relates to a metallic packaging structurized chip-type tantalum capacitor and a packaging method thereof. With the adoption of a metallic packaging structure, a layer of bonding conductive glue wraps outside a tantalum chip, and then a layer of metal shell wraps outside the bonding conductive glue; and meanwhile, one head of the tantalum chip is connected with a tantalum filament, and the tantalum filament is led out of the metal shell through a tantalum filament leading-out line to form the metallic packaging structurized chip-type tantalum capacitor. The tantalum filament and the tantalum filament leading-out line are connected together by welding, a welding point of the tantalum filament and the tantalum filament leading-out line is arranged on the inner surface of the metal shell, an insulation block sleeves outside the welding point of the tantalum filament and the tantalum filament leading-out line, the bonding conductive glue wraps between the insulation block and the tantalum chip and also wraps outside the insulation block, and thus, the spaces among the tantalum chip, the tantalum filament, the tantalum filament leading-out line and the shell are relatively fixed.

Description

technical field [0001] The invention relates to an electronic component and a manufacturing method thereof, in particular to a chip tantalum capacitor with a metal package structure and a manufacturing method thereof, so as to solve the problem of airtightness of resin packaged products, improve its reliability, and maintain a chip appearance at the same time Designed for ease of installation and use. It belongs to the technical field of making electronic components. Background technique: [0002] Chip solid tantalum capacitor is a polar component. In microelectronic circuits, the unidirectional conductivity of its dielectric layer can be used for filtering to filter out or reduce the amplitude of the remaining AC ripple signal in the DC signal. , The chip solid tantalum capacitor is characterized by long life, high temperature resistance, high accuracy, excellent high-frequency harmonic filtering performance, and various forms, excellent volume efficiency, has its unique ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G9/08H01G9/10H01G9/012H01G9/15
Inventor 钱武香毛云武李俊伟赖雨春
Owner ZHUZHOU HONGDA ELECTRONICS
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