Tile grinding cooling method and device

Abstract

The invention provides a tile grinding cooling method and device. Grinding is conducted in a dustproof cover, in the grinding process, cooling gas flows out of the outlet of the bottom end of a transmission shaft in the middle of a grinding wheel, flows out of the grinding wheel along the space between the grinding wheel and a tile surface from the middle of the grinding wheel in a radial mode, and then converges and flows out of an exhaust opening of the lower portion of the dustproof cover; or, the cooling gas flows out from an inner cavity of the dustproof cover to the position, for grinding a tile, of the grinding wheel, and then converges and flows out of the exhaust opening of the lower portion of the dustproof cover after cooling the grinding face of the grinding wheel. Compared with the prior art, the tile grinding cooling method and device have the advantages that the grinding tool does not need to exert large pressure on the tile, the temperature of the grinding tool during grinding can be effectively decreased, and burn marks and scratches are avoided.

Description

Technical field: [0001] The invention relates to a ceramic processing technology. Background technique: [0002] The ceramic processing technology used in the market is: wet polishing→drying→dry edging→packaging. [0003] Ceramic tiles are polished to remove the glaze layer of about 0.1mm on the surface. Because the existing technology is wet polishing, the adhesion to the belt is small, so it is necessary to increase the pressure to enhance the adhesion to the belt to prevent the brick from moving, and the pressure is too high. Large, and it is easy to crack the tiles. In addition, if the pressure is too high, the amount of grinding will be large during grinding, and the abrasive tool will quickly rise to high temperature, causing burn marks to remain on the brick surface, making the surface of the brick surface rough and scratched. Invention content: [0004] The object of the invention of the present invention is to provide a cooling method for grinding tiles that does...

AI Technical Summary

Problems solved by technology

[0003] Ceramic tiles are polished to remove the glaze layer of about 0.1mm on the surface. Because the existing technology is wet polishing, the adhesion to the belt is small, so it is necessary to increase the pressure to enhance the adhesion to the belt to prevent the brick from moving, and the pressure is too high. Large, and it is easy to crack the tiles. In addition, if the pressure is too large, the amount of grinding will be large during grinding, and the abrasive tool will quickly rise to high temperature, causing burn marks to remain on the brick surface, making the surface of the brick surface rough and scratched.

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