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Thermal expansion-proof flake alumina porous ceramic used for LED lamp heat dissipation, and preparation method thereof

A technology of flake alumina and porous ceramics, which is applied in the field of porous heat dissipation ceramics, can solve problems such as inhomogeneous alumina dispersion, uneven ceramic structure, and poor compatibility, so as to reduce cracking and failure problems, improve heat resistance, good transition effect

Inactive Publication Date: 2015-12-02
合肥凯士新材料贸易有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method cannot disperse the alumina uniformly, it is easy to agglomerate, and the ceramic structure is not uniform, and if the ceramic sheet is applied to the LED heat sink, it is necessary to improve the toughness, thermal conductivity, crack resistance, and heat resistance of the ceramic.
The compatibility between the ceramic sheet and metal is relatively poor and needs to be improved

Method used

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Examples

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Embodiment Construction

[0015] A flake-shaped alumina porous ceramic for heat dissipation of LED lamps with anti-thermal expansion, made of the following raw materials in parts by weight (kg): α-Al 2 o 3 (particle size 2-8μm) 345, deionized water 103, sodium polyacrylate 0.2, methyl cellulose 2.1, glycerin 1.7, spodumene 2.3, eucryptite 2.3, lithium carbonate 0.5, dirhodium trioxide 0.5 , nano aluminum hydroxide 4.5, nano copper 1.4, PVA binder 1.

[0016] The production method of the described heat-expansion-proof LED lamp heat dissipation flake aluminum oxide porous ceramic is characterized in that:

[0017] (1) Pulverize spodumene and eucryptite, pass through a 200-mesh sieve, and mix with α-Al 2 o 3 , deionized water, and sodium polyacrylate were mixed to obtain a suspension, and the suspension was ball milled for 5 hours, then lithium carbonate and rhodium trioxide were added, and mixed evenly, then PVA binder was added, mixed evenly, then nano-aluminum hydroxide was added, and ball milled 0...

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PUM

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Abstract

The invention discloses a thermal expansion-proof flake alumina porous ceramic used for LED lamp heat dissipation. The flake alumina porous ceramic is prepared from, by weight, 34 to 36 parts of alpha-Al2O3 (particle size ranging from 2 to 8<mu>m), 100 to 105 parts of deionized water, 0.2 to 0.3 part of sodium polyacrylate, 2 to 2.3 parts of methylcellulose, 1.6 to 1.8 parts of glycerin, 2 to 2.5 parts of spodumene, 2 to 2.5 parts of eucryptite, 0.4 to 0.6 part of lithium carbonate, 0.4 to 0.6 part of rhodium sesquioxide, 4 to 5 parts of nano-aluminium hydroxide, 1.2 to 1.5 parts of nano-copper, and 0.9 to 1.1 parts of PVA binder. Interlayer channels of the thermal expansion-proof flake alumina porous ceramic are communicated; transition performance and thermal fatigue resistance are excellent; nano-aluminium hydroxide is added, so that a problem, that aggregation of aluminium oxide particles is easily caused, is solved; spodumene, lithium carbonate, and rhodium sesquioxide are added, so that ceramic heat resistance is improved; eucryptite is added, so that cracking caused by thermal expansion is reduced, and heat fatigue resistance is improved.

Description

technical field [0001] The invention relates to the field of porous heat-dissipating ceramics, in particular to a sheet-shaped aluminum oxide porous ceramic for thermal expansion-resistant LED lamp heat dissipation and a preparation method thereof. Background technique [0002] Light-emitting diode (LED) is a type of light-emitting device that can directly convert electrical energy into visible light and radiant energy. It has strong market potential, and high-power LEDs are considered by the industry to be the main direction of the lighting source market1. At the current level, high-power LEDs can only convert 10% to 20% of the input power into light energy, and the remaining 80% to 90% are converted into heat energy. In order to ensure its normal operation, it is necessary to ensure that the operating temperature of the LED is within the allowable range through an effective heat dissipation design. Therefore, the heat dissipation problem of high-power LED chips has become...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/10C04B38/06
Inventor 董照海
Owner 合肥凯士新材料贸易有限公司
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