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Lead-free solder paste

A technology of lead-free solder paste and tin powder, applied in the direction of welding medium, welding/cutting medium/material, metal processing equipment, etc. The point is firm and safe to use

Inactive Publication Date: 2015-12-09
SUZHOU LOTTE CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Among them, tin-lead solder paste is mostly used for solder paste with a melting point greater than 200 degrees Celsius, which is harmful to the human body and the environment, and is not conducive to long-term use.

Method used

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Examples

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Embodiment Construction

[0017] The following will clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0018] Embodiments of the invention include:

[0019] A lead-free solder paste, the composition ratio includes:

[0020] 80 parts tin powder,

[0021] 6 parts of silver powder,

[0022] 3 parts copper powder,

[0023] 6 parts tin-silver alloy,

[0024] 4 parts tin-copper alloy,

[0025] 1 part of soldering flux, using tin, copper, silver and their alloys instead of traditional tin-lead solder paste, non-toxic, harmless, wide source, safe to use.

[0026] Preferably, the particle size range of the tin powder, si...

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PUM

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Abstract

The invention discloses lead-free solder paste which comprises the following components: 80 parts of tin powder, 6 parts of silver powder, 3 parts of copper powder, 6 parts of tin-silver alloy, 4 parts of tin-copper alloy and 1 part of scaling powder. With the adoption of the lead-free solder paste provided by the invention, the advantages of uniform dispersion, high easiness in welding, high firmness in welding spots, long service life, stable performance, extensive sources and high safety in use and the like are achieved, and a wide market prospect in popularization of lead-free solder paste is further achieved.

Description

technical field [0001] The invention relates to the field of electronic reagents, in particular to a lead-free solder paste. Background technique [0002] Solder paste is widely used in the field of industrial production. Solder paste has a certain viscosity at room temperature and can initially stick electronic components to a predetermined position. At the soldering temperature, with the volatilization of solvents and some additives, the soldered components and The printed circuit pads are soldered together to form a permanent connection. [0003] Among them, tin-lead solder paste is mostly used for solder paste with a melting point greater than 200 degrees Celsius, which is harmful to the human body and the environment, and is not conducive to long-term use. Contents of the invention [0004] The technical problem mainly solved by the present invention is to provide a lead-free solder paste, which is uniformly mixed with powder particles of tin, copper, silver and thei...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26
CPCB23K35/025B23K35/262
Inventor 杨伟帅
Owner SUZHOU LOTTE CHEM TECH
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