Deformable radiator assembling structure

A technology for assembling structure and radiator, applied in the direction of cooling/ventilation/heating transformation, etc., which can solve the problems of limited radiator and unfavorable radiator replacement.

Inactive Publication Date: 2015-12-16
HEFEI BITLAND INFORMATION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] General motherboards have several fixed mounting holes for fixing the heat sink, but the reserved mounting holes for motherboards of different manufacturers or motherboards of different platforms are different, so it is necessary to make different heat sinks for different hole positions , which leads to the installation conditions of only one radiator in different mounting holes, resulting in limited selection of radiators during assembly. In the case of damage to the supporting radiator, it is not conducive to the replacement of the radiator

Method used

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  • Deformable radiator assembling structure
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Embodiment Construction

[0018] refer to figure 1 , figure 2 , a deformable heat sink assembly structure proposed by the present invention includes: a heat dissipation plate 1 , a telescopic rod 2 , a fan 5 and a heat pipe 6 .

[0019] The telescopic rods 2 are installed on one side of the cooling plate 1, and each telescopic rod 2 includes a first connecting rod 21 and a second connecting rod 22 installed coaxially, and the first end of the first connecting rod 21 passes through the first connecting mechanism 3 It is installed on the radiator plate 1 in a hinged manner, and the first connecting rod 21 can be rotated in a plane parallel to the radiator plate 1 on the axis of the first connecting mechanism 3, and the first end of the second connecting rod 22 is connected from the first connecting rod. Insert the second end of 21, the distance between the second end of the second connecting rod 22 and the first end of the first connecting rod 21 can be adjusted, the second end of the second connecting...

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Abstract

The invention discloses a deformable radiator assembling structure comprising a heat-dissipating plate and telescopic rods installed on a side of the heat-dissipating plate. The first end of each telescopic rod is installed on the heat-dissipating plate through a first connecting mechanism. The telescopic rods may rotate about the first connecting mechanism and in a plane in parallel with the heat-dissipating plate. The distance between the second end of each telescopic rod and the first end of corresponding telescopic rod can be adjusted along the length direction. The second end of each telescopic rod is provided with a second connecting mechanism used for installing the deformable radiator assembling structure on an assigned position. The telescopic rods rotate with a certain angle in the plane in parallel with the heat-dissipating plate and then the lengths of the telescopic rods are adjusted such that the second connecting mechanism may move with the movement of the second ends of the telescopic rods. Thus, the deformable radiator assembling structure may cooperate with fixing structures at different positions in order to satisfy the positioning of the heat-dissipating plate in different installing environments.

Description

technical field [0001] The invention relates to the technical field of radiators, in particular to a deformable radiator assembly structure. Background technique [0002] Because electronic components work for a long time in a high-temperature environment, they are easy to burn out, especially small electrical appliances such as computers that are manually operated. If the surface temperature is too high, it is easy to cause damage to the human body. Therefore, the heat dissipation of electrical appliances, especially computer motherboards, has always been a problem that people pay attention to. At present, the heat dissipation of computer motherboards mainly uses radiators. [0003] General motherboards have several fixed mounting holes for fixing the heat sink, but the reserved mounting holes for motherboards of different manufacturers or motherboards of different platforms are different, so it is necessary to make different heat sinks for different hole positions , which...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
Inventor 孔程唐秋艳
Owner HEFEI BITLAND INFORMATION TECH
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