Supercharge Your Innovation With Domain-Expert AI Agents!

Maskless direct-writing photolithography machine suction cup structure with back surface alignment function

A backside alignment and maskless technology, which is applied in microlithography exposure equipment, photolithography exposure equipment, etc., can solve the problems of complex structure and high operation complexity, achieve ingenious layout, clear and accurate acquisition, and reduce operation complexity sex and cost effects

Inactive Publication Date: 2015-12-23
HEFEI CHIP FOUND MICROELECTRONICS EQUIP CO LTD
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the defects of complex structure and high operation complexity in the prior art, and provide a sucker structure of a maskless direct writing lithography machine with back alignment function to solve the above problems

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Maskless direct-writing photolithography machine suction cup structure with back surface alignment function
  • Maskless direct-writing photolithography machine suction cup structure with back surface alignment function
  • Maskless direct-writing photolithography machine suction cup structure with back surface alignment function

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] In order to have a further understanding and understanding of the structural features of the present invention and the achieved effects, the preferred embodiments and accompanying drawings are used for a detailed description, as follows:

[0022] Such as figure 1 As shown, the suction cup structure of a maskless direct writing lithography machine with back alignment function described in the present invention includes an upper suction cup 1 and a lower suction cup 2, and the structure of the upper suction cup 1 is as follows image 3 Shown, the structure of lower sucker 2 is as follows Figure 4 As shown, both the upper suction cup 1 and the lower suction cup 2 are fixedly installed and formed together to form a suction cup body 5 . Such as figure 2 and image 3 As shown, the suction cup body 5 is provided with the required air passage 6, air extraction hole 7, Unicom hole 8, positioning hole 9 required for the positioning of the substrate 22, the suction hole 10, ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a maskless direct-writing photolithography machine suction cup structure with a back surface alignment function. Compared with the prior art, the defects of complicated structure and high operation complexity are overcome. A left mounting groove and a right mounting groove are formed in the back surface of an upper suction cup, a right image acquisition assembly is mounted in the right mounting groove, and a left image acquisition assembly and the right image acquisition assembly are same in structure; and a light-passing hole A, a light-passing hole B, a light-passing hole C and a light-passing hole D are formed in the upper suction cup, the light-passing hole A and the light-passing hole B are formed in the upper parts of two reflecting prisms of the left image acquisition assembly respectively, the light-passing hole C and the light-passing hole D are formed in the upper parts of two reflecting prisms of the right image acquisition assembly respectively, the light-passing hole B and the light-passing hole C correspond to two reference marks of a substrate respectively, and the light-passing hole A and the light-passing hole D are both formed in the periphery of the substrate. The maskless direct-writing photolithography machine suction cup structure can be suitable for image acquisition in a back surface alignment mode, and a suction cup body can be directly arranged on a working platform to work.

Description

technical field [0001] The invention relates to the technical field of a maskless direct writing photolithography machine, in particular to a suction cup structure of a maskless direct writing photolithography machine with a back alignment function. Background technique [0002] The suction cup is an important part of the maskless direct writing lithography equipment. During the working process, the suction cup tightly adheres the substrate to be etched to the worktable through vacuum adsorption to ensure the flatness of the substrate during the etching process and realize Backside-aligned image capture clearly captures reference marks on the backside of the substrate and transfers the captured image to the image receiver system. The back alignment is mainly to observe the reference mark on the substrate (substrate) through the image relay device, and calculate the working platform coordinates of the real substrate through the object-image relationship of the relay image d...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G03F7/20
Inventor 曹常瑜
Owner HEFEI CHIP FOUND MICROELECTRONICS EQUIP CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com