The invention relates to the technical field of
wafer suction cups, in particular to a suction cup type
transfer mechanism for wafers, which comprises a mechanical arm, a support ring, a suction cup
assembly, a gas circuit structure and a driving unit, and is characterized in that the support ring is arranged at the output end of the mechanical arm; the suction cup
assembly comprises a supporting block and a suction cup body, the supporting block is arranged on the supporting ring, the suction cup body is rotationally arranged in the supporting block, the suction cup body is a conical body, a conical gap channel is formed between the suction cup body and the supporting block, a guide piece is arranged on the
conical surface of the suction cup body, and the guide piece is located in the gap channel and spirally arranged around the central axis of the suction cup body; the
air channel structure comprises a first
air channel and a second
air channel which are externally connected with an air source, the first air channel and the second air channel are both formed in the supporting block, the first air channel communicates with the gap channel, and the second air channel leads to the bottom face of the suction cup body; the driving unit is arranged on the supporting ring and used for driving the suction cup body to rotate. The suction cup
assembly provided by the invention not only has relatively high adsorption efficiency, but also can be more stable when the
wafer is sucked.