Photosensitive resin composition, photospacer, protective film for color filters, and protective film or insulating film of touch panel

A technology of photosensitive resin and composition, which is applied in the field of photosensitive resin composition, can solve the problems of reduced productivity, long developing time, and inability to obtain photosensitive resin composition, etc., and achieve excellent adhesion, high developability, excellent Effect of elastic recovery properties

Active Publication Date: 2015-12-23
SANYO CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, regardless of the method, the resin composition is hydrophobic, so there is a problem that the development time is long and the productivity is reduced, and it is impossible to obtain a photosensitive resin composition that can have both high elasticity and high developability.

Method used

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  • Photosensitive resin composition, photospacer, protective film for color filters, and protective film or insulating film of touch panel
  • Photosensitive resin composition, photospacer, protective film for color filters, and protective film or insulating film of touch panel
  • Photosensitive resin composition, photospacer, protective film for color filters, and protective film or insulating film of touch panel

Examples

Experimental program
Comparison scheme
Effect test

manufacture example 1

[0184] 60 parts of styrene, 20 parts of methyl methacrylate, 20 parts of methacrylic acid and diethylene glycol dimethyl ether 217 share. After the gas phase in the system was replaced with nitrogen, a solution 36 of 6 parts of 2,2'-azobis(2,4-dimethylvaleronitrile) dissolved in 30 parts of diethylene glycol dimethyl ether was added. parts, heated to 90°C, and further reacted at the same temperature for 4 hours. Further, 15 parts of glycidyl methacrylate and 1 part of triethylamine were added to the obtained solution, and reacted at 90° C. for 6 hours to obtain 30% diethylene glycol dimethyl of hydrophilic vinyl resin (A-1). base ether solution.

[0185] The solid conversion acid value of the hydrophilic vinyl resin was 131.5. Mn based on GPC was 4,000. In addition, the SP value of the hydrophilic vinyl resin was 10.8, and the HLB value was 7.1.

manufacture example 2

[0187] 90 parts of styrene, 10 parts of methyl methacrylate, 30 parts of methacrylic acid, and 327 parts of propylene glycol monomethyl ether acetate were placed in a glass flask equipped with a heating and cooling / stirring device, a reflux cooling tube, and a nitrogen introduction tube. share. After replacing the gas phase in the system with nitrogen, add a solution 38 of 8 parts of 2,2'-azobis(2,4-dimethylvaleronitrile) dissolved in 30 parts of propylene glycol monomethyl ether acetate. parts, heated to 90°C, and further reacted at the same temperature for 4 hours. Further, 15 parts of glycidyl methacrylate and 1 part of triethylamine were added to the obtained solution, and reacted at 90° C. for 6 hours to obtain 30% propylene glycol monomethyl ether ethyl alcohol of hydrophilic vinyl resin (A-2). acid ester solution.

[0188] The solid conversion acid value of the hydrophilic vinyl resin was 96.1. Mn based on GPC was 4,500. In addition, the SP value of the hydrophilic ...

manufacture example 3

[0190] Put cresol novolak type epoxy resin "EOCN-102S" (Nippon Kayaku Co., Ltd. epoxy equivalent weight 200 ) and 145 parts of propylene glycol monomethyl ether acetate were heated to 90°C to dissolve them uniformly. Next, 76 parts of acrylic acid, 2 parts of triphenylphosphine, and 0.2 part of p-methoxyphenol were added, and it was made to react at 90 degreeC for 10 hours.

[0191]91 parts of tetrahydrophthalic anhydrides were further added to the reactant, further reacted at 90° C. for 5 hours, and then diluted with propylene glycol monomethyl ether acetate so that the content of the hydrophilic epoxy resin became 60%, A 60% propylene glycol monomethyl ether acetate solution of the hydrophilic epoxy resin (A-3) was obtained.

[0192] The solid conversion acid value of the hydrophilic epoxy resin was 88.4. Mn based on GPC was 2,200. In addition, the SP value of the hydrophilic epoxy resin was 11.3, and the HLB value was 9.8.

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Abstract

The objective of the present invention is to provide a photosensitive resin composition which has high developability and provides a cured product that has excellent elastic modulus recovery characteristics and adhesion, and which enables the formation of a highly fine spacer. A photosensitive resin composition according to the present invention is characterized by containing (A) a hydrophilic resin, (B) a polyfunctional (meth)acrylate, (C) a photopolymerization initiator, (D) a solvent having an HLB of from 8.0 to 30.0 (inclusive) and (E) a compound which is a condensation product that has a compound represented by general formula (1) as an essential constituent monomer. (In formula (1), R1 represents one or more organic groups which are selected from the group consisting of a (meth)acryloyloxyalkyl group, a glycidoxyalkyl group, a mercaptoalkyl group and an aminoalkyl group, in each of which an alkyl group having 1-6 carbon atoms; R2 represents an aliphatic saturated hydrocarbon group having 1-12 carbon atoms or an aromatic hydrocarbon group having 6-12 carbon atoms; R3 represents an alkyl group having 1-4 carbon atoms; M represents one or more atoms selected from the group consisting of a silicon atom, a titanium atom and a zirconium atom; and m represents 0 or 1.)

Description

technical field [0001] The present invention relates to a photosensitive resin composition. Specifically, the present invention relates to a photosensitive resin composition applied to a photospacer, a protective film for a color filter, a protective film for a touch panel, or an insulating film for a touch panel. Background technique [0002] In recent years, liquid crystal display devices have attracted much attention, and photosensitive resins are often used in their manufacturing processes. For example, a photosensitive resin in which colored pigments are dispersed is used in a pixel portion corresponding to a color filter, and a photosensitive resin is also used in a black matrix. [0003] Conventionally, in a liquid crystal display panel, beads having a predetermined particle diameter are used as an optical spacer to provide a space between two substrates. However, the dispersion of these beads is random, and there is a problem that the contrast of the liquid crystal...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/075G02F1/1339G03F7/004
CPCG03F7/0007G03F7/0043G03F7/0048G03F7/027G03F7/033G03F7/038G03F7/0757G03F7/40G02F1/133519G02F1/13398
Inventor 山下真友子酒井优
Owner SANYO CHEM IND LTD
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