A kind of outer layer etching method of thick copper plate

A thick copper plate and etching technology, which is applied to the removal of conductive materials by chemical/electrolytic methods, electrical components, and printed circuit manufacturing. It can solve problems such as unclean etching, achieve good etching effect, good uniformity, and reduce production scrap. rate effect

Active Publication Date: 2018-07-06
JIANGMEN SUNTAK CIRCUIT TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims at the problem that the dense circuit area on the upper surface is not completely etched while the area with fewer circuits is over-etched when the outer layer of the existing thick copper plate is etched, and provides an outer layer etching method for a thick copper plate with good etching uniformity

Method used

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  • A kind of outer layer etching method of thick copper plate
  • A kind of outer layer etching method of thick copper plate

Examples

Experimental program
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Effect test

Embodiment

[0016] This embodiment provides a method for etching the outer layer of a thick copper plate, the thickness of the bottom copper of the outer layer of the thick copper plate is 3OZ, and the thick copper plate includes a first surface (ie, a TOP surface) and a second surface.

[0017] According to the existing positive film process, the outer layer circuit is made on the thick copper plate, which includes the following processes in turn: grinding plate → film attachment → exposure → development → electroplating copper → electrotin plating → film stripping → outer layer etching → tin stripping.

[0018] 1. Before the outer layer is etched, the pre-process is carried out according to the existing technology, as follows: board entry → bulking → film removal → washing → inspection. The process parameters are as shown in the table below (use the film stripping solution commonly used in this field, such as industrial grade sulfuric acid, industrial grade sodium hydroxide).

[0019] ...

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Abstract

The invention relates to the technical field of PCB production, in particular to an outer layer etching method of a thick copper plate. The present invention adopts two etchings and changes the up and down direction of the thick copper plate during the two etchings, so that the two surfaces of the thick copper plate are respectively facing down once to receive the etching solution sprayed from bottom to top, and at the same time, the thick copper plate is adjusted to pass through the etching cylinder speed and adjust the process parameters such as the spray pressure of the etchant and the concentration of the etchant. The adjusted process parameters are matched with the two etching methods, so that the outer layer of the thick copper plate is etched uniformly, and the area with dense lines can be etched clean. In areas with fewer lines, there will be no problems of over-etching and thin etching lines. The etching effect of the outer layer etching of the thick copper plate by the method of the invention is good.

Description

technical field [0001] The invention relates to the technical field of PCB production and manufacturing, in particular to an outer layer etching method of a thick copper plate. Background technique [0002] The production of PCB (Printed Circuit Board, printed circuit board) generally includes the following processing links: material cutting → negative film process to make inner layer circuit → pressing → drilling → sinking copper → full board electroplating → positive film process to make outer layer circuit → production Solder mask → surface treatment → molding. The positive film process also includes grinding plate→filming→exposure→development→copper electroplating→tin electroplating→film removal→outer layer etching→tin removal, in which the outer layer etching generally makes the production board pass through the etching cylinder horizontally, and the upper and lower parts of the production board are A shower head is provided, and the etchant is sprayed to the upper sur...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/06
CPCH05K3/06H05K3/067H05K2203/0786
Inventor 陈广龙白会斌胡志勇
Owner JIANGMEN SUNTAK CIRCUIT TECH
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