Liquid wax rotating device of wafer and waxing method

Abstract

The invention proposes a liquid wax rotating device of a wafer and a waxing method. The wax rotating device comprises a working table, an extension cylinder, an outer frame body, a baffle plate, a wax dripping device, a rotary absorbing mechanism and a mechanical arm, wherein the rotary absorbing mechanism comprises a rotating motor, a vacuum generator and a sucker; and the wax dripping device comprises a pneumatic valve and a needle. The wax rotating device is characterized by realizing a waxing technology of liquid wax of the wafer; compared with a traditional solid wax process, the waxing technology of liquid wax largely reduces the production cost by about 20%, and is excellent in waxing effect; and in subsequent polishing, a TTV value of an LED wafer is reduced by 10%, and a polishing exceeding proportion of the wafer is reduced from 5% to 0%, so that the problems of local pit caused by wax pasting and wafer break in the wax pasting process are totally eliminated.

Description

technical field [0001] The invention relates to the field of sapphire processing, in particular to a wafer liquid wax spinning device and a waxing method. Background technique [0002] The waxing process, as the traditional mounting method before LED wafer polishing, has always been one of the important processes that must and cannot be replaced. The pre-process of polishing the wafer surface. Waxing is mainly to heat the ceramic plate and wax at high temperature first, then apply wax on the ceramic plate, and then perform patching, and then pressurize and cool to make the wax solidify. There are many shortcomings in this method, specifically: the chip, the environment High cleanliness requirements, poor flatness of large-area chip placement, defects in wax cleaning in the later stage, and cumbersome processing procedures; [0003] As the shortcomings of the traditional process of solid wax continue to appear, customers' requirements for product flatness continue to increa...

AI Technical Summary

Problems solved by technology

Waxing is mainly to heat the ceramic plate and wax at high temperature first, then apply wax on the ceramic plate, and then carry out patching, and then pressurize and cool to make the wax solidify. There are many shortcomings in this method, specifically: the chip, the environment High cleanliness requirements, poor flatness of large-area chip placement, defects in wax cleaning in the later stage, and cumbersome processing procedures;

[0003] As the shortcomings of the traditional process of solid wax continue to appear, customers' requirements for product flatness continue to increase, and poor technical difficulties such as wafer cracks caused by poor uniformity of solid wax, waxing pits after polishing, and surface unevenness are of great concern to traditional LEDs. The product quality of substrate enterprises has a strong impact

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