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Automatic chip mounter

An automatic placement machine, patch technology, applied in the direction of electrical components, printed circuit manufacturing, printed circuits, etc., can solve the problems of inability to meet large-scale mass production, low work efficiency, and the accuracy of patching needs to be further improved. The effect of improving placement efficiency, improving quality, and improving positioning accuracy

Active Publication Date: 2016-01-06
KUNSHAN SAMON AUTOMATION TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing placement machines can only gradually complete the process of loading, absorbing, placing, and unloading, and the work efficiency is low, which cannot meet large-scale mass production; at the same time, the accuracy of placement needs to be further improved

Method used

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Embodiment Construction

[0032] The present invention will be further described in detail below in conjunction with the accompanying drawings, so that those skilled in the art can implement it with reference to the description.

[0033] It should be understood that terms such as "having", "comprising" and "including" as used herein do not entail the presence or addition of one or more other elements or combinations thereof.

[0034] Automatic placement machine of the present invention, as Figure 1 to Figure 3 As shown, it includes a first platform 10 for loading, a feeding mechanism 20, a feeding mechanism 30, a four-axis joint manipulator 40 and an electric control system (not shown in the figure). The feeding mechanism 20 includes a second platform 22 carrying a plurality of trays 21 , each tray 21 is equipped with a first patch, and the second platform 22 is rotatably connected to the top of the first platform 10 . The unloading mechanism 30 includes a third platform 32 carrying a plurality of fi...

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Abstract

The invention discloses an automatic chip mounter. The automatic chip mounter comprises a first platform for bearing, a feeding mechanism, a blanking mechanism and a four-axis joint mechanical arm; the feeding mechanism includes a second platform which bears a plurality of trays provided with first patches, wherein the second platform is rotatably connected above the first platform; the blanking mechanism includes a third platform which bears a plurality of accommodating devices provided with second patches to be subjected to chip mounting; the third platform is rotatably connected above the first platform; the four-axis joint mechanical arm includes a base fixed on the first platform, a rotary arm of which one end is rotatably connected with the base, a lifting rod of which the upper end is connected with the other end of the rotary arm in a lifting manner, and a suction nozzle which is rotatably connected with the lower end of the lifting rod; and under the joint action of the rotary arm and the lifting rod, the suction nozzle moves to the second platform to suck the first patches and moves to the third platform and arranges the first patches on the second patches, so that patch mounting can be realized; the second platform can rotate by 180 degrees at a horizontal direction; and the third platform can rotate by 180 degrees at a horizontal direction. The automatic chip mounter of the invention has the advantages of high chip mounting efficiency and high accuracy.

Description

technical field [0001] The invention relates to a placement device, more specifically, the invention relates to an automatic placement machine. Background technique [0002] With the development of science and technology, modern electronic components are developing in the direction of miniaturization, integration and high reliability. With increasingly fierce market competition, the production and manufacturing equipment of electronic products are developing towards high-speed, high-precision, intelligent, multi-functional and other fully automated directions. The production of electronic products, especially the assembly of key component printed boards, needs to go through the SMT process. [0003] The existing placement machines can only gradually complete the process of loading, absorbing, placing, and unloading. The work efficiency is low and cannot meet large-scale mass production; at the same time, the accuracy of placement needs to be further improved. Contents of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/30
CPCH05K3/303H05K2203/163
Inventor 林少渊
Owner KUNSHAN SAMON AUTOMATION TECH
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