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A manufacturing process of rigid-flex boards with different rigid board areas on both sides

A rigid-flex board and manufacturing process technology, used in printed circuit manufacturing, electrical components, printed circuits, etc., can solve the problems of hard board overlapping, difficult to separate, unable to ensure flatness, etc.

Active Publication Date: 2018-08-10
江西弘信柔性电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The large side of normal production cannot guarantee the flatness, and it is difficult to separate when it overlaps with the hard board

Method used

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  • A manufacturing process of rigid-flex boards with different rigid board areas on both sides
  • A manufacturing process of rigid-flex boards with different rigid board areas on both sides

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Experimental program
Comparison scheme
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Embodiment Construction

[0017] The present invention provides a rigid-flex board manufacturing process with different rigid board areas on both sides, which includes the following steps: S1: lamination, S2: X-RAY shooting, S3: milling edge, S4: outer layer drilling , S5: Deburring, S6: Desmear, S7: Immersion copper, S8: Whole board electro-copper, S9: Outer circuit pretreatment, S10: Outer laminate film, S11: Outer circuit exposure, S12: Outer Circuit etching-DES, S13: Outer layer AOI inspection, S14: Solder mask pretreatment, S15: Solder mask printing, S16: Pre-bake, S17: Solder mask exposure, S18: Solder mask development, S19: First baking, S20: Uncovering, S21: Gold, S22: Silkscreen, S23: Second baking, S24: Milling, S25: Finished product cleaning, S26: Electrical performance test, S27: Laser shape, S28: Press bonding, S29: The third baking, S30: finished product inspection-FQC, S31: packaging, S32: storage.

[0018] Such as figure 1 As shown, the step S1: lamination is to sequentially separate the ...

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Abstract

The invention relates to a rigid-flex PCB manufacturing process for a rigid slab with two non-uniformly-sized sides. The process comprises the steps of S1, laminating; S2, shooting at a target by means of X-rays; S3, milling the edge of a board; S4, drilling holes in the outer layer of the board; S5, removing burrs; S6, removing adhesive residues; S7, electroplating copper; S8, electroforming copper on the entire board; S9, pre-treating a circuit on the outer layer of the board; S10, pressing a film onto the outer layer of the board; S11, exposing the circuit on the outer layer of the board; S12, etching and conducting the DES treatment on the circuit on the outer layer of the board; S13, conducting the AOI detection on the outer layer of the board; S14, conducting the preweld treatment; S15, printing a solder mask; S16, pre-baking; S17, exposing the solder mask; S18, developing the solder mask; S19, baking for the first time; S20, de-capping; S21, conducting the electroless nickel / immersion gold; S22, silk printing; S23, baking for the second time; S24, milling the board; S25, cleaning a finished product; S26, testing electrical properties; S27, conducting the profile radiumization; S28, stitching; S29, baking for the third time; S30, checking and conducting the FQC treatment on the finished product; S31, packaging; S32, warehousing. The rigid-flex PCB manufacturing process is simple in operation, easy to implement, practical and high in efficiency.

Description

Technical field [0001] The invention relates to the field of circuit board processing, in particular to a process for manufacturing a rigid-flex board with different rigid board areas on both sides. Background technique [0002] With the development of electronic products toward light, thin, short, and multifunctional, flexible and rigid composite boards are increasingly used in industries, medical equipment, mobile phones, LCD TVs and other consumer products due to their excellent durability and flexibility. Electronic products. With the popularity of mobile phone handprint recognition, due to the small size of the mobile phone, the normal rigid-flex board cannot be installed. The handprint recognition components need to be large on one side and small on the other side. The large side of normal production cannot guarantee flatness, and at the same time it overlaps with the hard board and is difficult to separate. Summary of the invention [0003] In order to cope with the abov...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/36
CPCH05K3/361H05K2203/068
Inventor 李胜伦钱小进黎军郑冬华
Owner 江西弘信柔性电子科技有限公司