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Semiconductor device and curable silicone composition for sealing semiconductor element

A semiconductor and silicone technology, applied in the field of curable silicone compositions to achieve high reliability and excellent adhesive properties

Active Publication Date: 2018-06-22
DOW TORAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

On the other hand, in hydrosilylation curable silicone compositions, silicone compounds bonded to sulfur atoms and having silicon atom-bonded hydrolyzable groups such as 3-mercaptopropyltrimethoxysilane tend to cause curing Inhibition, therefore the use of silicone compounds as adhesion promoters has not been studied

Method used

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  • Semiconductor device and curable silicone composition for sealing semiconductor element
  • Semiconductor device and curable silicone composition for sealing semiconductor element

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example 1～5 and comparative example 1～7

[0057] The following components were uniformly mixed according to the compositions (parts by mass) shown in Table 1 to prepare curable silicone compositions of Examples 1-5 and Comparative Examples 1-7. In Table 1, SiH / Vi refers to the total number of moles of silicon-bonded hydrogen atoms in component (B) relative to 1 mole of total vinyl groups in component (A) in the curable silicone composition.

[0058] The following components were used as component (A). Organopolysiloxanes can be obtained by known production methods. The viscosity is a value measured at 25° C. using a B-type viscometer in accordance with JIS K7117-1. The vinyl content is measured by analytical methods such as FT-IR, NMR or GPC.

[0059] Component (a-1): dimethylpolysiloxane (vinyl content = 0.48% by mass) whose molecular ends are terminated by dimethylvinylsiloxy groups, which has a viscosity of 300 mPa·s, and is The following average formula expresses: Me 2 ViSiO(Me 2 SiO) 150 SiMe 2 Vi

[0060...

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Abstract

The present invention provides a semiconductor device obtained by sealing a gold-plated lead or substrate and a semiconductor element with a cured silicone, wherein the cured silicone is a cured product of a hydrosilylation curable silicone composition, The hydrosilylation reaction curable silicone composition includes at least: (A) an organopolysiloxane having at least two alkenyl groups in the molecule, (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen groups in the molecule Atomic organohydrogenpolysiloxane, (C) an organosilicon compound bonded to a sulfur atom and having a silicon atom-bonded hydrolyzable group, and (D) a platinum-based hydrosilylation reaction catalyst; and the semiconductor device Highly reliable performance after moisture reflow test.

Description

technical field [0001] The present invention relates to semiconductor devices and curable silicone compositions for sealing semiconductor elements in semiconductor devices. Background technique [0002] In optical semiconductor devices such as LEDs, silver-plated leads or substrates are used to prevent the leads or substrates from being corroded and to efficiently reflect light from light emitting diode (LED) elements. Silver has the problem of turning black from sulfur-containing gases such as hydrogen sulfide. For this reason, research has been conducted on the use of gold-plated leads or substrates that are inferior in reflectance to silver but do not turn black due to sulfur-containing gases. [0003] On the other hand, a hydrosilylation reaction-curable silicone composition is used as a sealant or an adhesive of a semiconductor element because the composition cures rapidly under heat and does not generate by-products during the curing process. Since the hydrosilylatio...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/29C08K5/548C08L83/05C08L83/07H01L23/31
CPCC08K5/548H01L23/296H01L33/56C08K5/5419C08K5/5425H01L2224/32245H01L2224/48091H01L2224/48247H01L2224/73265H01L2224/45144C08G77/12C08G77/20C08L83/04C08K5/56C08L83/00H01L2924/00014H01L2924/00H01L2924/00012
Inventor 宫本侑典吉田宏明
Owner DOW TORAY CO LTD