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A mems pressure gauge chip and its manufacturing process

A manufacturing process and technology of pressure gauges, applied in the field of MEMS sensors, can solve the problem that MEMS pressure gauges are not widely used in mine application fields.

Active Publication Date: 2017-12-29
INST OF GEOLOGY & GEOPHYSICS CHINESE ACAD OF SCI +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] Despite so many advantages, MEMS pressure gauges are still not widely used in mine applications

Method used

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  • A mems pressure gauge chip and its manufacturing process
  • A mems pressure gauge chip and its manufacturing process
  • A mems pressure gauge chip and its manufacturing process

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Embodiment Construction

[0052] The present invention will be described in detail below in conjunction with the embodiments and the accompanying drawings. It should be noted that the described embodiments are only intended to facilitate the understanding of the present invention, rather than limiting it in any way.

[0053] refer to figure 1 , figure 2 ,as well as image 3 According to the present invention, a MEMS pressure gauge chip includes a substrate 1 , a device part 2 , and a cover plate 3 connected to each other. Wherein, a silicon oxide layer 4 is formed between the substrate 1 and the device part 2 ; and a silicon oxide layer 4 is also formed between the device part 2 and the cover plate 3 . Recesses 5 corresponding to each other are also formed in the substrate 1 and the cover plate 3 . The recessed parts 5 are connected to each other to form a sealed cavity, and the device part 2 is located in the cavity. exist Figure 4 , Figure 5 and Figure 6 , the area of ​​the cavity is shown...

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Abstract

The invention relates to the field of sensors, in particular to a MEMS pressure gauge chip and a manufacturing method thereof. A pressure gauge, comprising a cavity, and a MEMS pressure gauge chip arranged in the cavity; the pressure gauge chip, comprising a substrate connected to each other, a device part and a cover plate, between the substrate and the device part And a silicon oxide layer is formed between the device part and the cover plate; recessed parts are respectively formed on the substrate and the cover plate, the substrate recessed part and the cover plate recessed part form a cavity, and the device part is located in the cavity; The device part includes a bridge part and a piezoresistive measuring element, and the piezoresistive measuring element is arranged on the bridge part. The pressure gauge chip is less affected by temperature, can be used in a high temperature environment, and has the characteristics of high detection accuracy, high reliability, low manufacturing cost and the like.

Description

technical field [0001] The invention relates to a MEMS sensor, in particular to a MEMS pressure gauge for detecting pressure changes in mines. Background technique [0002] In the process of exploration and exploitation of hydrocarbon mines, the measurement of downhole pressure is very important. The pressure data collected while drilling will be used to set the parameters of the drill and establish the structure of the mine. Once a well is drilled and production begins, pressure data is used again for oil and gas storage management. So throughout the life of a hydrocarbon mine, pressure data is critical, especially in optimizing production and reducing risk. For this reason, people need a pressure measuring device that can be accurate and cost-effective. [0003] Pressure sensors used in downhole hydrocarbons must maintain accuracy, stability and reliability over weeks of measurement in harsh operating environments. Usually the sensor must be able to withstand temperatu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01L9/04
CPCB81B7/0061G01L9/0054B81B2201/0264B81B2203/0109B81B2203/0118B81C2203/0109G01L9/04G01B7/16B81B3/0072B81C1/00142B81C1/0015B81C1/00158B81C3/001G01L9/0052
Inventor 周显良王文
Owner INST OF GEOLOGY & GEOPHYSICS CHINESE ACAD OF SCI
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