Device and method for achieving automatic grabbing and accurate attaching of aircraft thermal insulation piece

Abstract

The invention relates to a device and method for achieving automatic grabbing and accurate attaching of an aircraft thermal insulation piece. The device comprises an outer frame module, a main shaft module, a normal leveling module, a vision alignment module, a pressure detection module and a suction cup set module. By means of the vision alignment module, the center of the thermal insulation piece and the center of the area where the thermal insulation piece is to be attached can be accurately found, the thermal insulation piece can be accurately attached to a machine body, and accuracy of all attached positions of the thermal insulation piece is ensured. By means of the normal leveling module, the axis of a motor, the center of a corresponding suction cup and the curved surface normal of the thermal insulation piece accurately coincide, and therefore tension and pressure can coincide with the normal of the thermal insulation piece all the time, and it is ensured that the force direction is perpendicular to the outer surface of the thermal insulation piece all the time when attachment and adhesion detection are conducted; the force, in the axial direction, of the motor is detected in real time through the pressure detection module, and therefore accurate and closed-loop control over loading of the motor is achieved; and by means of the suction cup set module, flexible design and adjustment of the diameter, the number and positions of suction cups are achieved according to requirements, and thermal insulation pieces of different sizes and irregular shapes are grabbed.

Description

technical field [0001] The invention belongs to the field of digital assembly, and specifically relates to a device and method suitable for automatic grasping and precise fitting of heat shields of aircrafts, so as to improve assembly efficiency and assembly quality. Background technique [0002] Automatic placement devices have been used in the field of electronic product production and processing. At present, commonly used automatic placement devices include: mechanical system, vision system and control system. Patent CN103152994A invented a high-efficiency sticker head with multiple suction nozzles synchronously sucking and sticking. The motion-driven structure connection makes up for the defect that the existing placement machine adopts a single suction nozzle suction form, and realizes the chip placement on the PCB board, with high efficiency and good interchangeability; patent CN103717006A invented a high-precision placement The chip head device, including a chip hea...

AI Technical Summary

Problems solved by technology

Patent CN103152994A invented a high-efficiency sticker head with multiple suction nozzles synchronously sucking and sticking. The motion-driven structure connection makes up for the defect that the existing placement machine adopts a single suction nozzle suction form, and realizes the chip placement on the PCB board, with high efficiency and good interchangeability; patent CN103717006A invented a high-precision placement The chip head device, including the chip head frame and multiple chip head mechanisms, solves the problems of low work efficiency, low placement accuracy, stability and reliability of the chip mounter of the existing chip mounter

Existing patents on automatic patch capture are concentrated in the field of electronic product production. Their functions are single, and the accuracy guarantee mainly depends on the reciprocating motion of the mechanical device, that is, it mainly relies on the repeated positioning accuracy of the transmission mechanism, and lacks certain flexibility and adaptability. Spend

However, the aircraft heat shield has large size, various shapes, and high precision requirements. The current equipment and methods cannot meet the precision requirements of automatic grasping and bonding.

Images