Printed circuit board with net as substrate

Abstract

The invention discloses a printed circuit board with a net as a substrate, which is named as a net substrate. The net substrate comprises a substrate net, an upper-layer conductive layer, and a middle bonding layer, wherein the substrate net is a metal wire net or a metal board punching net woven in a high density mode; a metal film or a thin printed circuit board or a flexible printed circuit board (FPC) is used for making a needed circuit graph for welding a connection element, places without wiring and without elements on the upper-layer conductive layer are removed, and places where pins of a mounted element or heat sinks need to be directly contacted with the substrate net are perforated; and the middle bonding layer is a prepreg or a high temperature-resisting adhesive, a vacuum thermal lamination process is adopted to laminate the substrate net and the upper-layer conductive layer as a whole, and the pins or the heat sinks, which need to be directly contacted with the substrate net, of the element can be directly welded or bonded by using a thermal conductive adhesive on the substrate net. The printed circuit board with the net as the substrate can be used in fields in need of air circulation and heat dissipation, and has the advantages of good heat dissipation effects, light weight, flexibility, and low cost.

Description

technical field [0001] The invention relates to a printed circuit board, in particular to a printed circuit board with a net as the base. Background technique [0002] Printed circuit board is a basic material in the electronics industry. It is made of copper film and various substrates. The substrate materials include paper, glass fiber, copper, aluminum, ceramics and other special materials. Different substrates give printing Different special properties of circuit boards. Existing printed circuit boards are generally hard boards. Existing flexible printed circuit boards (FPC) are flexible. Although they are flexible, they are still boards and do not have the advantage of ventilation and heat dissipation. [0003] In the prior art, ZL201310050182.9 once proposed a flexible Led lamp net, which directly welds the heat conduction seat of the SMT-packaged Led lamp bead to the heat dissipation net, and its heat dissipation effect is better than that of the aluminum substrate p...

AI Technical Summary

Problems solved by technology

[0005] The main purpose of the present invention is to overcome the shortcomings of various existing printed circuit boards that cannot ventilate and dissipate heat, overcome the defects of non-standard connection methods and non-scaled defects in ZL201310050182.9, and provide a printed circuit board with a new structure, namely A printed circuit board based on a mesh, named mesh substrate

Images