Feeder and manufacturing method thereof
A manufacturing method and feeder technology, applied in the direction of electrical components, electrical components, etc., can solve the problems of BGA chips that cannot be stacked, and achieve the effects of improving operation efficiency, simple structure, and low cost
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[0031] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.
[0032] The purpose of this embodiment is to provide a feeder and a manufacturing method thereof, which are used to solve the problem that BGA chips cannot be stacked with other chips in the prior art. The principle and implementation of the feeder and its manufacturing method of this embodiment will be described in detail below, so that those skilled in the art can understand the feeder of this embodiment and its manufacturing method w...
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