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Pulley device for silicon wafer cutting machine

A cutting machine and pulley technology, which is applied to fine working devices, working accessories, stone processing equipment, etc., can solve the problems such as the difficulty of wheel body replacement, and achieve the effect of convenient assembly and operation

Active Publication Date: 2017-01-18
郎溪品旭科技发展有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a pulley device for a silicon wafer cutting machine, aiming at overcoming the disadvantage of difficulty in changing the wheel body of the pulley device for a multi-wire cutting machine in the prior art

Method used

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  • Pulley device for silicon wafer cutting machine
  • Pulley device for silicon wafer cutting machine
  • Pulley device for silicon wafer cutting machine

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Embodiment Construction

[0016] A pulley device for a silicon wafer cutting machine of the present invention will be further described below in conjunction with the accompanying drawings. Such as figure 1 , figure 2 , image 3 As shown, a pulley device for a silicon wafer cutting machine includes a pulley body 1, a wheel body 2 is fixed on the pulley body 1, and the wheel body 2 is fixed on the pulley body 1 through an outer cover 3. The pulley body 1 is fixed with a connecting sleeve 5, and a rolling bearing is installed in the inner cavity of the connecting sleeve 5, and a fixed shaft cooperating with the rolling bearing is fixed on the cutting machine, and the pulley main body 1 is fixed on the cutting machine through the rolling bearing to support the diamond wire Or correct, so that the cutting machine can work normally;

[0017] see figure 1 , figure 2 , image 3 , a connecting sleeve 4 is provided between the wheel body 2 and the pulley main body 1, the wheel body 2 is sleeved on the co...

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Abstract

The invention relates to a sliding wheel device used for a silicon wafer sawing machine, which solves the defect in the prior art that a wheel body is difficult to change for the sliding wheel device of a multi-wire sawing machine. Compared with the prior art, the sliding wheel device used for the silicon wafer sawing machine provided by the invention is characterized in that a connection bushing is arranged on a sliding wheel body; a shoulder is arranged on the connection bushing; a connection sleeve is locked on the shoulder through an outer cover; a wheel body is fixed on the connection sleeve; a snap ring is arranged on the wheel body; a neck is formed in the connection sleeve; during assembly, the wheel body is assembled onto the connection sleeve by utilizing the elastic deformation of the wheel body, so that the assembly operation is very convenient; when the wheel body needs to be changed, the wheel body can be detached from the connection sleeve by simply utilizing the elastic deformation of the wheel body, and then a new wheel body can be assembled instead; and the outer cover does not need to be detached, so that the operation is very convenient.

Description

technical field [0001] The invention relates to a silicon chip cutting machine accessory, in particular to a pulley device for a silicon chip cutting machine. Background technique [0002] Multi-wire cutting machines are widely used in the production of silicon wafers due to their high cutting efficiency. The cutting body of the multi-wire cutting machine is a diamond wire, which cuts the silicon ingot. Therefore, multiple pulley devices for supporting or correcting the diamond wire are fixed on the multi-wire cutting machine. [0003] The pulley device used for multi-wire cutting machines in the prior art includes a pulley main body, on which a wheel body is arranged, and the wheel body is pressed by an outer cover fixed on the pulley main body. In the specific cutting process, the wheel body needs to be replaced frequently. For the pulley device in the prior art, if the wheel body needs to be replaced, the outer cover must be taken off, and then the wheel body can be take...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D7/00B28D5/04
Inventor 陈小力张国华
Owner 郎溪品旭科技发展有限公司
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