Method and equipment for preparing compact thin film by electrostatic spraying method

Abstract

The invention provides a method for preparing a compact thin film by an electrostatic spraying method. The method comprises the following steps that at least two spray nozzles are adopted for spraying at least two kinds of precursors to the same substrate or collecting device; after meeting on the substrate or in the collecting process, the precursors carry out a chemical reaction so as to generate a thin film. According to the method, the spray nozzles simultaneously spray the precursors to the substrate or collecting device, or sequentially spray the precursors to the substrate or collecting device; the distance between the spray nozzles is adjustable; relative positions of the spray nozzles and the substrate or collecting device are adjustable. The method disclosed by the invention is low in cost, simple to operate, and high in repeatability; the thin film prepared by the method disclosed by the invention is not liable to crack.

Description

technical field [0001] The invention belongs to the technical field of thin film manufacturing in micro-nano optoelectronic devices, in particular to a method and equipment for preparing a crack-free and dense thin film based on a double-nozzle or multi-nozzle electrostatic spraying method. Background technique [0002] The liquid phase method is a common technology for preparing thin films such as silicon oxide. It has the advantages of low cost, easy operation, and can be used on flexible substrates. It has received more and more attention, and has been widely used in various fields such as electronics, optics, electromagnetics, thermals, chemistry and the preparation of composite materials. [0003] In the process of preparing thin films by liquid phase method, pulling method and spin coating method are two common coating methods. At present, the common liquid phase method to prepare silicon oxide film is to use sol-gel method to generate silicon oxide sol first, and the...

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Problems solved by technology

The reason is that the precursor reactant has undergone a chemical reaction to form a certain liquid phase before the film is coated in both the pulling method and the spin coating method, which will lead to a small amount of reactant in the liquid phase. Particles or other micro-nanostructures, the size of these tiny particles or other micro-nanostructures is usually on the order of tens of nanometers to several microns, which is several orders of magnitude larger than the molecular atomic particles of the precursor reactant itself, so that in thin films It is difficult to connect together well, which is not conducive to the final dense film, and the resulting film is also easy to crack

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