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A kind of jig and method convenient for BGA chip power supply test

A test fixture and power test technology, applied in power test and other directions, can solve the problems of dense BGA chip layout, inaccurate test results, and inability to accurately simulate BGA pull load, etc., to achieve accurate test results, stable and stable switching power supply Sex-enhancing effect

Active Publication Date: 2019-03-15
LANGCHAO ELECTRONIC INFORMATION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since there is a certain distance between the output terminal of the switching power supply and the load chip, this test method is not consistent with the actual working conditions of the circuit, which will lead to inaccurate test results and problems that do not conform to the actual situation.
[0005] Due to the dense layout of the BGA chip, it is impossible to solder the electronic load inside the BGA, so that it is impossible to accurately simulate the loading of the BGA. Image 6 The power module shown (including the power chip, output inductor, and output capacitor) is simulated and tested. This test method does not conform to the actual design situation.

Method used

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  • A kind of jig and method convenient for BGA chip power supply test
  • A kind of jig and method convenient for BGA chip power supply test
  • A kind of jig and method convenient for BGA chip power supply test

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Experimental program
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Effect test

Embodiment 1

[0027] Such as Figure 5 Shown, a kind of test fixture that is convenient to BGA chip power supply test, described test fixture structure comprises: fixture BGA Pad part 1 of the lowest layer, it is stratum 3, power supply stratum 2, stratum 3 successively on it, and is arranged on The specific fixing device 4 for connecting the power supply or the ground part, wherein the structure of the BGA Pad part 1 of the fixture is the same as that of the back of the BGA chip, and the structure of the fixing device 4 includes a hollow part and fastening screws, and the hollow part is used to connect the load cable The wire hole, the fastening screw is responsible for fixing the load cable in the wire hole to form a connection.

[0028] This BGA fixture adopts a reasonable four-layer board design, and the BGA Pad of the fixture is designed to be exactly the same as the BGA chip Pad, and its power pad and ground Pad are connected to the outside of the fixture by design to facilitate the c...

Embodiment 2

[0030] On the basis of embodiment 1, the present embodiment is a kind of convenient BGA chip power supply test method, and in circuit board test process, BGA chip is taken off, described test fixture is installed in the position of former BGA chip, in test fixture Connect the electronic load instrument to simulate the load test, so that the load simulation of the load BGA chip can be realized; finally, the corresponding test is carried out on the switching power supply design.

Embodiment 3

[0032] On the basis of embodiment 2, the implementation steps of the method described in this embodiment are specifically as follows:

[0033] 1) According to the size and position of the pad of the BGA chip to be tested, design a test fixture that is completely consistent with the BGA Pad. The structure of the test fixture includes a four-layer circuit board. Consistent, above this layer are stratum 3, power supply layer 2, and stratum 3 in sequence. The internal power supply and ground pad of the jig are connected to the fixing device 4 through the via hole design. The fixing device 4 is composed of a hollow part wire hole and a fastening screw. The wire hole is used to connect the load cable, and the fastening screw is used to fix the load cable in the wire hole;

[0034] 2) Remove the BGA chip of the circuit board to be tested, place the test fixture on the position of the BGA chip, and fix the fixture;

[0035] 3) Connect the output cables of the electronic load meter to...

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Abstract

The invention discloses a test jig which is convenient for BGA chip power supply testing. The test jig structure includes: the lowermost BGA Pad part of the jig, on which there are stratum, power supply layer, and stratum in sequence, and a part set on the fixture. The fixing device used to connect the power supply or the ground part. The structure of the BGA Pad part of the fixture is the same as the back of the BGA chip. The structure of the fixing device includes a hollow part and fastening screws. The hollow part is a wire hole for connecting the load cable. The screws secure the load cables in the conductor holes to form the connection. The invention realizes the load simulation consistent with the BGA chip through reasonable fixture design and use, solves the problem that the circuit board switching power supply cannot be tested at the actual BGA load end during the testing process, and the switching power supply test results are more accurate and more in line with In reality, the switching power supply after using this test is more stable, and the stability of the circuit board design is also greatly improved.

Description

technical field [0001] The invention relates to the technical field of switching power supply testing, in particular to a fixture and method for testing a BGA chip power supply. Background technique [0002] In the field of electronic design, the circuit board is the physical carrier of all electronic design content, and the final realization of all electronic design intentions must be realized through the design of the circuit board. So circuit board design is an integral part of any electronic device. Among them, the power supply design of the key part of the circuit board widely uses switching power supply, which greatly promotes the rapid development of switching power supply technology. While the switching power supply is developing towards high frequency, high reliability, low power consumption, low noise, and integration, it also puts forward stricter requirements for product function and performance testing. [0003] The switching power supply is the direct provide...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/40
Inventor 李德恒
Owner LANGCHAO ELECTRONIC INFORMATION IND CO LTD