Efficient heat dissipation substrate for optoelectronic devices

Abstract

The invention discloses a high-efficiency heat dissipation substrate for optoelectronic devices. Heat dissipation is carried out from its conductive layer, and a composite heat dissipation substrate is formed by sequentially laminating and combining a heat conduction insulating layer, a metal substrate and a carbon-based material coating, wherein another part of the heat conduction insulation layer One side of the surface is closely combined with the conductive layer of the optoelectronic device, and the exposed surface of the other side of the carbon-based material coating forms the external heat dissipation surface of the composite heat dissipation substrate. Layers, metal substrates and carbon-based material coatings are exported to dissipate heat. The invention improves the dielectric constant, antistatic ability and heat dissipation ability of the substrate by coating a layer of thermally conductive and insulating ceramic coating on the upper surface of the high thermal conductive metal substrate as an insulating layer; the lower surface of the metal substrate is coated with a layer of carbon with good thermal conductivity. The base material coating has high thermal conductivity and thermal radiation coefficient, which can further improve the overall heat dissipation performance of the substrate.

Description

technical field [0001] The invention relates to a photoelectric device, in particular to a heat dissipation part of the photoelectric device, which is applied in the technical field of photoelectric device heat dissipation. Background technique [0002] In recent years, with the rapid development of intelligent and miniaturized electronic products, the power density of electronic components has increased significantly while the physical size has become smaller and smaller, and the heat flux has also increased. The corresponding rise in junction temperature will inevitably affect The performance of electronic components requires more efficient thermal control. Therefore, effectively solving the heat dissipation problem of electronic components has become a key technology in the manufacture of electronic components and electronic equipment. [0003] As one of the typical electronic products, the thermal management of optoelectronic devices has also become one of the important...

AI Technical Summary

Problems solved by technology

The low thermal conductivity of FR4 cannot meet the heat dissipation requirements of the device, and the ceramic substrate is difficult to form, it is difficult to obtain a large-area plate, and it is difficult to reduce the cost, which cannot meet large-scale use. Therefore, the current development of optoelectronic device packaging substrates focuses on MCPCB substrates

The choice of insulating layer material on the MCPCB substrate will also affect the overall heat dissipation performance. Generally, the insulating layer on the MCPCB is mostly an epoxy layer, which can meet the insulation requirements, but the thermal conductivity is poor, which greatly affects the overall heat dissipation of the device.

The MCPCB substrate generally uses aluminum as the main metal substrate, and its blackness is low, which cannot effectively use the heat radiation channel to improve the heat dissipation performance of the MCPCB

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