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Display panel and manufacturing method thereof

A technology for a display panel and a manufacturing method, which is applied in the manufacturing of semiconductor/solid-state devices, semiconductor devices, electrical components, etc., can solve the problems of poor packaging effect, fracture of inorganic layers, poor water and oxygen isolation effect, etc., and achieves the improvement of packaging effect. Effect

Active Publication Date: 2018-06-01
SHANGHAI TIANMA MICRO ELECTRONICS CO LTD +1
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0005] Embodiments of the present invention provide a display panel and a manufacturing method thereof, which can solve the problem that the inorganic layer in the packaging structure of the existing display panel is prone to breakage, so that the packaging effect is poor, and the effect of isolating water and oxygen is not good.

Method used

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  • Display panel and manufacturing method thereof
  • Display panel and manufacturing method thereof
  • Display panel and manufacturing method thereof

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Embodiment Construction

[0025] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, only parts related to the present invention are shown in the drawings but not all content.

[0026] An embodiment of the present invention provides a display panel.

[0027] figure 1 It is a schematic cross-sectional view of the structure of an implementation manner of the display panel provided by the embodiment of the present invention. Such as figure 1 As shown, the display panel includes: an array substrate 101 and an encapsulation structure 102 , the encapsulation structure 102 is disposed on the array substrate 101 ; an organic light emitting structure 103 is disposed between the array substrate 101 and the en...

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Abstract

The invention discloses a display panel and a manufacturing method thereof, wherein the display panel includes an array substrate and a packaging structure arranged on the array substrate, an organic light-emitting structure is arranged between the array substrate and the packaging structure, The encapsulation structure includes a stacked structure composed of at least one organic layer and at least one inorganic layer, wherein at least one side of the inorganic layer close to the organic layer is sputtered with a metal element, forming a layer comprising the metal Interfacial mixed structures of elemental and inorganic layer materials. The invention can improve the encapsulation effect and the ability of isolating water and oxygen.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a display panel and a manufacturing method thereof. Background technique [0002] With the rapid development of display technology, the application of display panels is becoming more and more extensive. Existing display panels mainly include liquid crystal display panels and organic light emitting display panels. Compared with the liquid crystal display panel, the organic light-emitting display panel contains an organic light-emitting structure capable of emitting light without an additional backlight module, and has attracted people's attention. [0003] Existing organic light emitting display panels include an array substrate, an organic light emitting structure and a packaging structure stacked sequentially from bottom to top. In order to make the organic light-emitting display panel not only withstand a certain stress, but also isolate water and oxygen, the packaging struc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/32H01L21/77
CPCH01L21/77H10K59/00H10K59/12
Inventor 钱旭曹兆铿
Owner SHANGHAI TIANMA MICRO ELECTRONICS CO LTD
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