Light-emitting diode module with light-emitting diodes bonded by solder paste and light-emitting diodes
A technology of light-emitting diodes and solder paste, applied in electrical components, electric solid-state devices, circuits, etc., can solve problems such as device failures, short-circuits of light-emitting diodes, etc., and achieve the effects of improving reflectivity, simple mesa structure, and improving current spreading performance
Active Publication Date: 2017-10-20
SEOUL VIOSYS CO LTD
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- Application Information
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Problems solved by technology
Since the pad is directly adjacent to the solder paste in these LED modules, metal elements such as tin in the solder paste can diffuse into the LED through the pad, causing a short circuit in the LED, thereby causing device failure
Method used
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[0058] Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. It should be understood that the following examples are given by way of illustration only in order to provide those skilled in the art with a thorough understanding of the present invention. Therefore, the present invention is not limited to the following embodiments and can be implemented in various ways. Also, the width, length and thickness of some elements, layers or features may be exaggerated for clarity, and the same reference numerals will be used throughout to refer to like parts.
[0059] figure 1 is a schematic side sectional view of a light emitting diode module according to an embodiment of the present invention.
[0060] refer to figure 1 , the LED module includes: a printed circuit board 51 having pads 53a, 53b; and a light emitting diode 100 bonded to the printed circuit board 51 via solder paste 55 . The light emitting diod...
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The invention discloses a light emitting diode and a light emitting diode module. The light emitting diode module includes a printed circuit board and light emitting diodes bonded to the printed circuit board by solder paste. The light emitting diode includes a first electrode pad electrically connected to the first conductive type semiconductor layer and a second electrode pad connected to the second conductive type semiconductor layer, wherein the first electrode pad and the second electrode pad Each electrode pad includes at least five pairs of titanium / nickel layers or at least five pairs of titanium / chromium layers and an uppermost gold layer. Accordingly, diffusion of metal elements such as tin in the solder paste is prevented, thereby providing a reliable light emitting diode module.
Description
technical field [0001] The present invention relates to a light emitting diode and a light emitting diode module, and more particularly, to a light emitting diode module including a light emitting diode bonded to a substrate such as a printed circuit board by solder paste. Background technique [0002] With the development of Gallium Nitride (GaN)-based Light Emitting Diodes (LEDs), GaN-based LEDs are used in various applications including natural color LED display devices, LED traffic signs, white LEDs, and the like. [0003] Generally, a GaN-based LED is formed by growing an epitaxial layer on a substrate such as a sapphire substrate, and includes an N-type semiconductor layer, a P-type semiconductor layer, and an active layer interposed therebetween. N-electrode pads are formed on the N-type semiconductor layer, and P-electrode pads are formed on the P-type semiconductor layer. The light emitting diodes are electrically connected to an external power source through elect...
Claims
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IPC IPC(8): H01L33/62
CPCH01L27/156H01L33/405H01L33/44H01L33/62H01L2224/16H01L33/36H01L25/167H01L33/0075H01L33/14H01L33/38H01L33/505H01L2933/0016H01L2933/0025H01L33/24H01L33/46H01L33/50H01L33/60
Inventor 蔡钟炫李俊燮徐大雄卢元英姜珉佑张锺敏
Owner SEOUL VIOSYS CO LTD