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Method and apparatus for dividing edged material of brittle material substrate

A technology for brittle material substrates and separation devices, which is applied to fine working devices, glass cutting devices, stone processing equipment, etc., to achieve the effect of simplifying the structure and shortening the working time

Inactive Publication Date: 2016-02-10
MITSUBOSHI DIAMOND IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Then, since end materials are generated around the substrate, the end materials must be cut and separated along the scribing line by a cutting device.

Method used

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  • Method and apparatus for dividing edged material of brittle material substrate
  • Method and apparatus for dividing edged material of brittle material substrate
  • Method and apparatus for dividing edged material of brittle material substrate

Examples

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Embodiment Construction

[0031] The end material separation table according to the embodiment of the present invention will be described. figure 1 It is a perspective view showing the overall configuration of the substrate cutting mechanism realizing the present embodiment, figure 2 It is a front view showing the overall configuration of the substrate cutting mechanism realizing the present embodiment. As shown in these figures, the beam 11 is held on the base 10 parallel to the upper surface of the base 10 by a bracket, and a linear slider 12 is provided on the side of the beam 11 . The linear slider 12 moves the end material separating head 13 freely along the beam 11 . Such as figure 2 As shown, the susceptor 10 is provided with a scribing table 14 for scribing a brittle material substrate (hereinafter simply referred to as a substrate), an end material separation table 15 for separating end materials described below, and a cutting table 16 . The end material separating head 13 sucks the subst...

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Abstract

The present invention provides a method and an apparatus for separating an edged material of a brittle material substrate. A substrate is aligned in a longitudinal direction and in a transverse direction to form a functional area, and the edged material surrounding the substrate having scribe lines formed thereon is surely separated. The substrate (20) is kept on an edge material separating stage (15). The edged material separation stage (15) includes a chamber (52), a base plate (53) positioned on the chamber (52), and an elastic plate (54). The elastic plate (54) and the base plate (53) have a plurality of openings. The substrate (20) positioned on the upper surface of the elastic plate (54) is kept by introducing air through the openings of the elastic plate (54). A pusher plate (47) having a frame-shape where sides facing each other have different heights is moved downward in parallel with the surface of the substrate (20), thereby separating the edged material surrounding the substrate (20).

Description

technical field [0001] The invention relates to an end material separation method and an end material separation device for separating end materials around brittle material substrates such as semiconductor substrates and ceramic substrates. Background technique [0002] Patent Document 1 proposes a substrate cutting device that cuts a substrate on which a scribe line is formed by pressing it along the scribe line perpendicularly to the surface with a cutting lever from the back surface of the surface on which the scribe line was formed. When the substrate to be cut is a semiconductor wafer and a plurality of functional regions are aligned and formed, first, scribe lines are formed on the substrate at equal intervals between the functional regions in the vertical and horizontal directions. Then, cutting must be carried out along the scribed line by means of a cutting device. Then, since end materials are generated around the substrate, the end materials must be cut and separ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D1/00B28D5/04B28D7/04C03B33/033
CPCB26F3/002C03B33/033H01L21/304
Inventor 太田欣也
Owner MITSUBOSHI DIAMOND IND CO LTD