Electroplate liquid and electroplate method for cyanide-free gold electroplating of sulfite
A cyanide-free gold plating and sulfite technology, applied in the field of electroplating copper and tin, can solve the problems of restricting the promotion of cyanide-free gold electroplating, low coating quality, poor plating solution performance, etc., and achieve excellent plating solution performance and high brightness. , the effect of good coating quality
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Embodiment 1
[0034] The formulation of the electroplating solution is as follows:
[0035]
[0036] Plating process conditions: the pulse width of single pulse square wave current is 0.5ms, the duty cycle is 30%, and the average current density is 0.5A / dm 2 ; The pH is 8, the temperature is 60°C, and the electroplating time is 40min.
Embodiment 2
[0038]The formulation of the electroplating solution is as follows:
[0039]
[0040]
[0041] Plating process conditions: the pulse width of single pulse square wave current is 0.6ms, the duty cycle is 25%, and the average current density is 0.6A / dm 2 ; The pH is 8.5, the temperature is 60°C, and the electroplating time is 35min.
Embodiment 3
[0043] The formulation of the electroplating solution is as follows:
[0044]
[0045] Plating process conditions: the pulse width of single pulse square wave current is 0.8ms, the duty cycle is 20%, and the average current density is 1A / dm 2 ; The pH is 9, the temperature is 50° C., and the electroplating time is 20 minutes.
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