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Hollow door

A hollow, panel technology, applied in door leaves, electrical components, semiconductor/solid device manufacturing, etc., can solve problems such as temperature loss, low temperature, and difficult maintenance of internal temperature

Active Publication Date: 2016-02-10
ACM RES SHANGHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing equipment adopts a single-layer metal door, and the external temperature is low, which will cause a large amount of temperature loss, making it difficult to maintain the internal temperature, and is more affected by the external environment

Method used

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Embodiment Construction

[0013] The above-mentioned features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, components are not necessarily drawn to scale, and components with similar related properties or characteristics may have the same or similar reference numerals.

[0014] Figures 1A to 1D The structure of the preferred embodiment of the hollow door of the present invention is shown from different angles of view. See also Figures 1A to 1D , The hollow door of this embodiment includes a first panel 1 , a second panel 2 and a hollow layer 3 sandwiched between the first panel 1 and the second panel 2 . The hollow layer 3 can be filled with air, an inert gas, or an intermediate vacuum, all in order to ensure a good heat insulation effect.

[0015] Preferably, a metal mirror coating is covered on the first panel 1 , and a metal mirror coa...

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Abstract

The invention discloses a hollow door. By the adoption of the hollow door, heat loss is reduced, environment temperature can be well maintained, and the certain requirements for heat insulation in the semiconductor wafer technology can be met. According to the technical scheme, a hollow layer used for heat insulation is designed between two panels to enable the interior of a certain space to be isolated from the outside. Compared with the prior art, the hollow door has the advantage that equipment, including a XeF2 etching system and a gumming machine, required to be at certain environment temperature in the semiconductor wafer technology can well meet the temperature requirement.

Description

technical field [0001] The invention relates to a door panel device, in particular to a door panel device used in semiconductor wafer manufacturing equipment. Background technique [0002] In the gas cabinet of the XeF2 etching system for semiconductor wafer manufacturing, because the substance XeF2 needs to be in a certain temperature to reach the gasification state, the higher the temperature, the faster the gasification rate will be. Usually the temperature in the gas cabinet is maintained at 45 degrees Celsius or above. The existing equipment adopts a single-layer metal door, and the external temperature is low, which will cause a large amount of temperature loss, making it difficult to maintain the internal temperature, and is more affected by the external environment. [0003] In addition, on the equipment of the gluing machine, the photoresist liquid supply bottle needs a certain temperature to be sufficient. Since the viscosity of the photoresist is relatively high...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): E06B3/70H01L21/67
Inventor 方志友金一诺张怀东王坚王晖
Owner ACM RES SHANGHAI
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