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Photosensitive resin composition, protective film and element having the same

A technology of photosensitive resin and composition, applied in the field of photosensitive resin composition and liquid crystal display element, can solve the problems of poor development resistance, reduced efficiency of electronic components, and reduced pattern accuracy.

Active Publication Date: 2016-02-10
CHI MEI CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] However, although the aforementioned two photosensitive resin compositions can improve the adhesiveness of the prepared protective film, they still have the defect of poor development resistance, which reduces the accuracy of the pattern to be made, thereby reducing the aforementioned electronic properties. component performance

Method used

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  • Photosensitive resin composition, protective film and element having the same
  • Photosensitive resin composition, protective film and element having the same
  • Photosensitive resin composition, protective film and element having the same

Examples

Experimental program
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Effect test

preparation example A-1

[0170] A nitrogen inlet, a stirrer, a heater, a condenser tube and a thermometer are arranged on a four-neck flask with a volume of 1000 milliliters. After introducing nitrogen, 5 parts by weight of methacrylic acid (hereinafter abbreviated as a1-1), 15 parts by weight of 9,9'-bis[3-phenyl-4-(2-methacryloyloxyethoxy base) phenyl] fluorene (hereinafter referred to as a2-2), 80 parts by weight of tert-butoxystyrene (hereinafter referred to as a3-2) and 240 parts by weight of diethylene glycol dimethyl ether (hereinafter referred to as Diglyme ) into the four-neck flask in one addition.

[0171] After the inside of the flask is filled with nitrogen, the reactants in the flask are mixed uniformly and the oil bath is heated to 85°C, and 3 parts by weight of 2,2'-azobis(2,4-dimethylvaleronitrile) ( (hereinafter referred to as ADVN) was dissolved in 20 parts by weight of Diglyme, divided into five equal parts, and added to the four-necked flask at intervals within one hour. The pol...

preparation example A-2 to A-11

[0173] Preparations A-2 to A-11 use the same preparation method as the preparation method of the alkali-soluble resin of Preparation A-1, the difference is that Preparations A-2 to A-11 change the raw materials in the alkali-soluble resin The type, usage amount and polymerization conditions, and its formula and polymerization conditions are shown in Table 1, and will not be described in detail here.

[0174] Preparation of photosensitive resin composition

Embodiment 1

[0177] In a three-necked flask with a capacity of 500 milliliters, 100 parts by weight of the alkali-soluble resin prepared in the aforementioned Preparation Example A-1, 5 parts by weight of 1-[1-(4-hydroxyphenyl) isopropyl]- 4-[1,1-bis(4-hydroxyphenyl)ethyl]benzene and o-naphthoquinonediazide-5-sulfonic acid formed o-naphthoquinone diazide sulfonate (hereinafter referred to as B-1 ) and 100 parts by weight of propylene glycol methyl ether acetate (PGMEA; hereinafter referred to as C-1). After stirring evenly with a shaker, the photosensitive resin composition of Example 1 can be prepared. The obtained photosensitive resin composition was evaluated by the evaluation method of the following development resistance, and the obtained result is shown in Table 2.

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Abstract

The present invention relates to a photosensitive resin composition, a protective film and an element having the same. The aforementioned photosensitive resin composition includes an alkali-soluble resin (A), an ortho-naphthoquinone diazide sulfonic acid ester (B) and a solvent (C). The alkali-soluble resin (A) is copolymerized by an unsaturated carboxylic acid or unsaturated carboxylic anhydride compound (a1), a fluorene derivative having a double-bond group (a2) and an unsaturated compound having an acid-decomposable group (a3).

Description

technical field [0001] The present invention relates to a photosensitive resin composition, a protective film formed by using the composition, and a liquid crystal display element having the protective film, in particular to provide a photosensitive resin composition with good development resistance, using the composition The protective film formed by the material and the liquid crystal display element with the protective film. Background technique [0002] In electronic components such as thin film transistor (ThinFilmTranstor; TFT) liquid crystal display components, magnetic head components, integrated circuit components, and solid-state imaging components, a protective film (also known as an interlayer insulating film) is generally provided between the wiring, and It can achieve the effect of insulation protection. [0003] Generally, the material for making the protective film is preferably selected so that the required pattern shape can be obtained with fewer steps and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/008G03F7/004
CPCC09D4/06C08F220/1807C08F220/1811C09D135/06
Inventor 吴明儒施俊安
Owner CHI MEI CORP