Flip-chip camera and manufacturing method thereof

Abstract

A crystallization camera involves the field of cameras and production methods.There is a difficult and high technical technology with high production and high costs to solve the existing camera packaging structure, including: the first substrate, the second substrate, the camera nude, infrared filter, shell and lens module;The noodle circuit board has the first pads on both sides. The first pad on the front is equipped with the first electrical tile, and the first substrate is equipped with a chip hole that is consistent with the shape of the camera.The camera nude film is the inverted film structure, embedded in the chip hole of the first substrate. The middle part of the front is the sensitivity area, the fourth pad is provided outside the periphery of the sensitivity area, and the fourth pad is provided with a fourth -guide electrical electricity.Blocks; encapsulation of circuit boards and rubber layers, between circuit boards and circuit boards, circuit boards and camera nude films are connected by conductive convex blocks. The packaging process is simple, the production cost is low, and the production efficiency is high.Compared with the traditional COB process overflowing process, it has the advantages of small volume, high performance, and short connection.The trend of the camera is thin and short, and the crystallization method has a good application in this regard.

Description

technical field The invention relates to the technical field of cameras and manufacturing methods. Background technique A camera is a component widely used in the electronics industry. At present, most of the cameras are CSP (Chip Scale Package refers to the chip size package, and its package size is basically the same as the core size of the chip) and COB (Chip On Board, chip-on-board process), and some use flip-chip (flip-chip) Way. CSP is a packaged chip, mostly used for low-end camera chips. However, due to the price and process difficulties in packaging, high-end cameras are mostly shipped as bare chips (die), and then the modules are manufactured by the module factory. At present, most of the module factories around the world use the traditional wire-bond method to make COB modules. The existing common packaging methods generally have technical deficiencies such as high production difficulty and high cost. Contents of the invention To sum up, the purpose of the...

AI Technical Summary

Problems solved by technology

In summary, the purpose of the present invention is to solve the existing camera packaging structure production difficulty, high technical deficiencies, and propose a flip-chip camera and its manufacturing method

Images