Surface-treated copper foil, copper foil with carrier, laminate, printed wiring board, electronic device, method of manufacturing surface-treated copper foil, and method of manufacturing printed wiring board

A technology of surface treatment layer and copper foil with carrier, which is applied in the direction of printed circuit manufacturing, printed circuit, printed circuit, etc., and can solve the problems of mismatching production steps of double-layer flexible printed wiring board, silane condensation, and reduced peel strength.

Active Publication Date: 2018-04-20
JX NIPPON MINING & METALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0022] However, when using a silane coupling agent containing hexavalent chromium to surface-treat the bonded surface of the copper foil and the resin substrate, there will be the following problems: it does not match the production steps of the double-layer flexible printed wiring board, and the peel strength will be reduced instead. decrease; in turn, it will promote the condensation of silane in the silane coupling agent

Method used

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  • Surface-treated copper foil, copper foil with carrier, laminate, printed wiring board, electronic device, method of manufacturing surface-treated copper foil, and method of manufacturing printed wiring board
  • Surface-treated copper foil, copper foil with carrier, laminate, printed wiring board, electronic device, method of manufacturing surface-treated copper foil, and method of manufacturing printed wiring board
  • Surface-treated copper foil, copper foil with carrier, laminate, printed wiring board, electronic device, method of manufacturing surface-treated copper foil, and method of manufacturing printed wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 12

[0217]

[0218] (1) Ni layer (Ni plating)

[0219] The carrier was electroplated using a roll-to-roll type continuous plating line under the following conditions, thereby forming a 1000 μg / dm 2 The amount of Ni layer attached. The specific plating conditions are described below.

[0220] Nickel sulfate: 270~280g / L

[0221] Nickel chloride: 35~45g / L

[0222] Nickel acetate: 10~20g / L

[0223] Boric acid: 30~40g / L

[0224] Gloss agent: saccharin, butynediol, etc.

[0225] Sodium lauryl sulfate: 55~75ppm

[0226] pH value: 4~6

[0227] Bath temperature: 55~65℃

[0228] Current density: 10A / dm 2

[0229] (2) Cr layer (electrolytic chromate treatment)

[0230] Next, after washing and pickling the surface of the Ni layer formed in (1), continue on the roll-to-roll type continuous plating line, and make 11 μg / dm by electrolytic chromate treatment under the following conditions. 2 The amount of Cr layer attached to the Ni layer.

[0231] Potassium dichromate 1~10g / L, zin...

Embodiment 13

[0249]

[0250] (1) Ni-Mo layer (nickel-molybdenum alloy plating)

[0251] The carrier was electroplated using a roll-to-roll type continuous plating line under the following conditions, thereby forming a 3000 μg / dm 2 The attached amount of Ni-Mo layer. The specific plating conditions are described below.

[0252] (Liquid composition) Ni sulfate hexahydrate: 50g / dm 3 , Sodium molybdate dihydrate: 60g / dm 3 , Sodium citrate: 90g / dm 3

[0253] (Liquid temperature) 30°C

[0254] (current density) 1~4A / dm 2

[0255] (power-on time) 3 to 25 seconds

[0256]

[0257] An ultra-thin copper layer is formed on the Ni-Mo layer formed in (1). The ultra-thin copper layer was formed on the same conditions as in Example 12 except that the thickness of the ultra-thin copper layer was 2 μm.

Embodiment 14

[0259]

[0260] (1) Ni layer (Ni plating)

[0261] The Ni layer was formed under the same conditions as in Example 12.

[0262] (2) Organic layer (organic layer formation process)

[0263] Next, after washing and pickling the surface of the Ni layer formed in (1), continue under the following conditions to rinse and spray the Ni layer surface for 20 to 120 seconds with a liquid temperature of 40°C and a pH of 5. An aqueous solution, thereby forming an organic layer, the aqueous solution containing carboxybenzotriazole (CBTA) at a concentration of 1 to 30 g / L.

[0264]

[0265] An ultra-thin copper layer is formed on the organic layer formed in (2). The ultra-thin copper layer was formed on the same conditions as in Example 12 except that the thickness of the ultra-thin copper layer was 3 μm.

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Abstract

The present invention relates to a surface-treated copper foil, a copper foil with a carrier, a laminate, a printed wiring board, an electronic device, a method for manufacturing a surface-treated copper foil, and a method for manufacturing a printed wiring board. It provides a surface-treated copper foil having good peel strength and capable of suppressing transmission loss well even if it is used for a high-frequency circuit board. The surface-treated copper foil has, in order, a copper foil, a metal layer containing one or more elements selected from the group consisting of Ni, Co, Zn, W, Mo, and Cr, and a surface-treated layer formed of chromium oxide. The total adhesion amount of elements selected from the group consisting of Ni, Co, Zn, W, Mo and Cr in the metal layer is 200-2000 μg / dm2, and after applying heat treatment at 250 ° C for 10 minutes, only the surface treatment layer is exposed When the state of the surface is immersed in a nitric acid bath with a concentration of 20mass% and a temperature of 25°C for 30 seconds, the amount of copper dissolved in the nitric acid bath is below 0.0030g / 25cm2.

Description

technical field [0001] The present invention relates to a surface-treated copper foil, a copper foil with a carrier, a laminate, a printed wiring board, an electronic device, a method for manufacturing a surface-treated copper foil, and a method for manufacturing a printed wiring board. Background technique [0002] From the perspective of ease of wiring and light weight, flexible printed wiring boards (hereinafter referred to as FPCs) are used in small electronic devices such as smartphones and tablet PCs. In addition, in FPC, there is a double-layer flexible printed wiring board as follows: After directly providing a base layer made of metal or metal oxide on an insulator substrate, a double-layer flexible substrate with a copper conductor layer formed is used. A required wiring pattern is formed by a subtractive method or an additive method. [0003] This double-layer flexible printed wiring board widely uses flat rolled copper foil. In recent years, in order to further...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/09H05K3/38C25D3/38
CPCH05K1/09H05K3/382C25D3/38H05K2201/0355
Inventor 神永贤吾福地亮
Owner JX NIPPON MINING & METALS CORP
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