45results about How to "Suppress transmission loss" patented technology

A high-frequency micro-strip line for transmitting a high-frequency wave for a wireless LAN system has a layered structure where, on a ground layer made of a conductive material, a dielectric layer made of a dielectric material and a signal line made of a conductive material are successively laid. The high-frequency micro-strip line further includes a patch antenna comprising a dielectric plate made of a dielectric material and a patch made of a conductive material, which are successively laid into a layered structure, the patch antenna being electrically connected to the signal line. A wireless-communication RF signal transmission device capable of being applied to such a line is also provided.

The present invention provides a transmission apparatus including transmitting side line interfaces which convert packet format data sent from an asynchronous network to a SONET/SDH frame format and then transmit the data, multiple receiving side line interfaces which receive the SONET/SDH frame format data and convert the data to packet format data and a circuit switching section which performs circuit switching. The transmitting side line interfaces include a variable length frame mapping section which converts the packet format data to variable length frame format data and a time division multiplexing mapping section which converts the variable length frame format data to the SONET/SDH frame format data. The receiving side line interfaces include a variable length frame demapping section which reconverts the SONET/SDH frame format data to variable length frame format data.

The present invention relates to a surface-processed copper foil, a copper foil with a carrier, a laminated body, a printed circuit board, an electronic equipment, a manufacturing method for the surface-processed copper foil and a manufacturing method for the printed circuit board. The surface-processed copper foil has good peeling strength and is capable of preventing transmission loss even though it is applied to a high frequency circuit board. The surface-processed copper foil of the present invention sequentially comprises: a copper foil, a metal layer including at least one element selected from a group composed of Ni, Co, Zn, W, Mo and Cr, and a surface-processed layer formed with chrome oxide. The adhesion amount of the elements selected from the group composed of Ni, Co, Zn, W, Mo and Cr in the metal layer is 200-2000[mu]g/dm<2>. After a heat process for 10 minutes under 250 DEG C, if the surface-processed copper foil is soaked in a nitric acid liquid whose concentration is 20 mass% and temperature is 25 DEG C for 30 seconds under a state that only the surface of the surface-processed layer is exposed, the dissolution amount of copper in the nitric acid liquid is less than 0.0030g/25cm<2>.

A shielded flat ribbon cable includes a plurality of insulated conductors being spaced parallel to each other, the insulated conductors each including an inner conductor and an insulation coating the inner conductor; an outer conductor bundling the insulated conductors together, the outer conductor including a first shell and a second shell in association with each other to sandwich the insulated conductors therebetween, each of the first shell and the second shell including a plurality of grooves covering outer surfaces of the insulated conductors, and a plurality of edge portions integral with both sides of the grooves, and gap formation-suppressing means for suppressing formation of gaps between the edge portions of the first shell and the edge portions of the second shell, respectively.

The invention provides an optical fiber winding method, a reeled optical fiber, and an optical fiber transport method. The fiber winding method can prevent a fiber reel from releasing when the transmission loss of the fiber is reduced at the same time. When a fiber (10) having a diameter of about 250 [mu]m is being wound on a bobbin (11) and a winding tension is set as T (N) and a transverse pitch is set as P (mm), the optical fiber (10) is wound on the bobbin (11) with T/P2 larger than or equal to 0.5 N/mm2 and smaller than or equal to 6.3 N/mm2.

The invention provides a highly-reliable, low-loss non-radiative dielectric waveguide. According to one aspect of the invention, a non-radiative dielectric waveguide comprises parallel planar conductors arranged at an interval of half or below of a high-frequency signal wavelength, and a dielectric strip interposed between the parallel planar conductors. The dielectric strip has a 0.01 to 0.3 mm-wide chamfer formed at its edge portion in a high-frequency signal transmission direction. According to another aspect of the invention, a non-radiative dielectric waveguide comprises parallel planar conductors arranged at an interval of half or below of a high-frequency signal wavelength, and a dielectric strip interposed between the parallel planar conductors. The dielectric strip is made of a ceramics having an open pore ratio of 5% or less.

In an optical fiber network for transmitting optical signals in a robot having three or more joints connecting a plurality of links in series such that the links include two end links located at either end and intermediate links provided between the two end links, and the links connected by the joints are moveable relative to each other, a plurality of optical transceiver modules are provided on the links such that at least one optical transceiver module is provided on each link; and a plurality of optical fiber cables connect the optical transceiver modules in a ring; wherein at least one end of each optical fiber cable connecting the optical transceiver modules provided on different links is connected to one of the optical transceiver modules provided on the intermediate links.

A surface-treated copper foil that is for a printed circuit board and that has a silane coupling agent layer on a surface on which roughened particles have been formed. The average height of the roughened particles on the silane-coupling-agent-layer surface is 0.05 [mu]m or more but less than 0.5 [mu]m, the BET surface area ratio of the of the silane-coupling-agent-layer surface is 1.2 or higher, and the micro-surface coefficient Cms of the silane-coupling-agent-layer surface is 2.0 or higher but less than 8.0.

A superior high-frequency magnetic material having a smaller ratio (μ″/μ′) of the real part μ′ of permeability and the imaginary part μ″ of permeability in a high-frequency region and an antenna device using thereof are provided. The high-frequency magnetic material includes a substrate and a composite magnetic film formed on the substrate that consists of a magnetic phase forming a plurality of columnar bodies whose longitudinal direction is directed in a direction perpendicular to a surface of the substrate and an insulator phase filling gaps of the columnar bodies, and the magnetic phase is amorphous and has in-plane uniaxial anisotropy of Hk2/Hk1≧3 and Hk2≧3.98×10³ A/m when a minimal anisotropic magnetic field in a plane in parallel with the surface of the substrate is Hk1 and a maximal anisotropic magnetic field is Hk2.

To provide a highly transparent treatment copper foil preferable for a print circuit board, which has excellent transmission characteristics, a high peeling strength with a resin base material, and a low degree of cloudiness (HAZE level) after etching. There is provided a treatment copper foil for a copper-clad laminate, including a roughening treatment layer 2 on at least one surface of an untreated copper foil 1 and an antioxidation treatment layer 3 on the roughening treatment layer 2. The roughening treatment layer 2 is made of fine copper particles with primary particles having diameters of 40nm to 200nm, and the antioxidation treatment layer 3 contains molybdenum and cobalt. The ten point height of irregularities, Rz of the treatment surface to be adhered to an insulating resin base material is 0.5 mum to 1.6 mum, and the color difference delta E*ab between the untreated copper foil 1 and the treatment surface is 45 to 60.

A photoelectric conversion module includes a photoelectric conversion element that converts an arriving optical signal transmitted via an optical fiber into an electrical signal, a signal output section that outputs a photoelectrically converted electrical signal to the exterior, an impedance matching circuit provided between an output electrode of the photoelectric conversion element and the signal output section, and a substrate upon which this impedance matching circuit is mounted, with the impedance matching circuit including a plurality of metallic coating layers formed upon the surface of the substrate with gaps being left between them, and a plurality of metallic connecting lines that electrically connect together adjacent ones of these metallic coating layers.

A method of manufacturing a photonic band gap fiber base material includes: a forming step of continuously forming a columnar core glass body 10 and a clad glass body 20 which coats the core glass body to obtain an intermediate base material 110; a hole making step of making holes 30 in the clad glass body 20; an insertion step of inserting in the holes 30 a plurality of bilayer glass rods 40 in which an outer layer 42 which has the same refractive index as the clad glass body coats high refractive index portions 41 having a higher refractive index than a refractive index of the clad glass body 20; and a heating step of heating the intermediate base material 110 and integrating the intermediate base material 110 and the bilayer glass rods 40.

A high frequency semiconductor device including wiring layers which are formed above a semiconductor substrate and in which transmission lines are formed by combining with a ground plate having a potential fixed at the ground potential, at least one crossing portion in which the wiring layers mutually cross, with insulating interlayers provided therebetween, and at least one separation electrode being selectively provided on one of the insulating interlayers, the at least one separation electrode having a potential fixed at the ground potential. Accordingly, in the high frequency semiconductor device, electrical interference between two crossing wiring layer is prevented and transmission loss is suppressed.

Provided is a high-speed test system and processing method thereof for an ATE machine. The test system comprises a test daughter board and a test mother board. The test mother board is provided with a spring needle connector array, and the test daughter board is provided with a test socket. The test daughter board, the spring needle connector array and the test mother board are connected through a pressing screw connection mode. The processing method is characterized by, to begin with, pressing spring needles to a spring needle connector module; then, installing the spring needle connector module to a step-shaped groove reserved in a metal base through a screw connection mode; and finally, installing a stud running through the whole height of the test system to the metal base, wherein the two ends of the stud are screwed with the test daughter board and the test mother board respectively and independently, and thus pressing assembling work of the test system is finished. The high-speed test system and processing method not only can ensure repeated use and maintenance of the test system, but also can realize high-precision control of signal link impedance, and thus integrity of high-speed signal of the test system is guaranteed.

A spin valve element including parallelly or serially connected magnetic element groups, each magnetic element group having a plurality of magnetic elements that each include an intermediate layer of an insulating member or a nonmagnetic member sandwiched by a pair of ferromagnetic layers. The plurality of magnetic elements are further connected either in series or in parallel.

A superior high-frequency magnetic material having a smaller ratio (μ″/μ′) of a real part μ′ of permeability and an imaginary part μ″ of permeability in a high-frequency region and an antenna system using thereof are provided. The high-frequency magnetic material includes a substrate and a composite magnetic film formed on the substrate and made of a magnetic phase forming a plurality of columnar bodies whose longitudinal direction is directed in a direction perpendicular to a surface of the substrate and an insulator phase filling gaps of the columnar bodies. The magnetic phase contains at least one of Nb, Zr, and Hf, and Fe and B, is amorphous, and has in-plane uniaxial anisotropy of Hk2/Hk1≧3 and Hk2≧3.98×10³ A/m when a minimal anisotropic magnetic field in a plane parallel to the surface of the substrate is Hk1 and a maximal anisotropic magnetic field is Hk2.

The invention discloses a design method for setting 10-degree wiring of high-speed signals on a single PCB (Printed Circuit Board). A design program for setting 10-degree wiring of the high-speed signals on the single PCB is developed by use of CADENCE AXLSKILL language; during specific operations, the SKILL program is put in a wiring tool installation document; once the SKILL program is executed, a prompting dialog box is popped up; the length of each section of 10-degree wiring is input according to the dialog, and then CLine needing to be designed into 10-degree wiring is selected, and therefore, the design of 10-degree wiring can be completed. Due to the adopted design method, the design of 10-degree wiring of high-speed signals can be realized very simply, either board or PCB design space is saved, and meanwhile, the transmission losses of high-speed signals in the board due to weaving effect are also effectively inhibited; the operating method of the design tool is also very simple and convenient.

A routing structure of a two-core parallel shielded electric wire includes:

• • two insulated electric wires that are arranged in parallel; and
  • a shield layer that is attached around the two insulated electric wires and extends in a longitudinal direction of the two insulated electric wires.

In the routing structure, the two-core parallel shielded electric wire is rerouted by bent twisting the two-core parallel shielded electric wire in a short axis direction at a route change point along a long axis direction of the two-core parallel shielded electric wire, and the number of bent twisted points in the short axis direction is 1.43 or less per meter.