The present invention relates to a surface-treated copper foil, a copper foil with a carrier, a laminate, a printed wiring board, an electronic device, a method for manufacturing a surface-treated copper foil, and a method for manufacturing a printed wiring board. It provides a surface-treated copper foil having good peel strength and capable of suppressing transmission loss well even if it is used for a high-frequency circuit board. The surface-treated copper foil has, in order, a copper foil, a metal layer containing one or more elements selected from the group consisting of Ni, Co, Zn, W, Mo, and Cr, and a surface-treated layer formed of chromium oxide. The total adhesion amount of elements selected from the group consisting of Ni, Co, Zn, W, Mo and Cr in the metal layer is 200-2000 μg / dm2, and after applying heat treatment at 250 ° C for 10 minutes, only the surface treatment layer is exposed When the state of the surface is immersed in a nitric acid bath with a concentration of 20mass% and a temperature of 25°C for 30 seconds, the amount of copper dissolved in the nitric acid bath is below 0.0030g / 25cm2.