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Surface-processed copper foil, copper foil with carrier, laminated body, printed circuit board, electronic equipment, manufacturing method for surface-processed copper foil and manufacturing method for printed circuit board

A technology of surface treatment layer and copper foil with carrier, which is applied in the direction of printed circuit manufacturing, printed circuit, printed circuit, etc., and can solve problems such as silane condensation, reduced peel strength, and mismatching production steps of double-layer flexible printed wiring boards.

Active Publication Date: 2016-02-10
JX NIPPON MINING & METALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0022] However, when using a silane coupling agent containing hexavalent chromium to surface-treat the bonded surface of the copper foil and the resin substrate, there will be the following problems: it does not match the production steps of the double-layer flexible printed wiring board, and the peel strength will be reduced instead. decrease; in turn, it will promote the condensation of silane in the silane coupling agent

Method used

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  • Surface-processed copper foil, copper foil with carrier, laminated body, printed circuit board, electronic equipment, manufacturing method for surface-processed copper foil and manufacturing method for printed circuit board
  • Surface-processed copper foil, copper foil with carrier, laminated body, printed circuit board, electronic equipment, manufacturing method for surface-processed copper foil and manufacturing method for printed circuit board
  • Surface-processed copper foil, copper foil with carrier, laminated body, printed circuit board, electronic equipment, manufacturing method for surface-processed copper foil and manufacturing method for printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 12

[0217]

[0218] (1) Ni layer (Ni plating)

[0219] The carrier was electroplated using a roll-to-roll type continuous plating line under the following conditions, thereby forming a 1000 μg / dm 2 The amount of Ni layer attached. The specific plating conditions are described below.

[0220] Nickel sulfate: 270~280g / L

[0221] Nickel chloride: 35~45g / L

[0222] Nickel acetate: 10~20g / L

[0223] Boric acid: 30~40g / L

[0224] Gloss agent: saccharin, butynediol, etc.

[0225] Sodium lauryl sulfate: 55~75ppm

[0226] pH value: 4~6

[0227] Bath temperature: 55~65℃

[0228] Current density: 10A / dm 2

[0229] (2) Cr layer (electrolytic chromate treatment)

[0230] Next, after washing and pickling the surface of the Ni layer formed in (1), continue on the roll-to-roll type continuous plating line, and make 11 μg / dm by electrolytic chromate treatment under the following conditions. 2 The amount of Cr layer attached to the Ni layer.

[0231] Potassium dichromate 1~10g / L, zin...

Embodiment 13

[0249]

[0250] (1) Ni-Mo layer (nickel-molybdenum alloy plating)

[0251] The carrier was electroplated using a roll-to-roll type continuous plating line under the following conditions, thereby forming a 3000 μg / dm 2 The attached amount of Ni-Mo layer. The specific plating conditions are described below.

[0252] (Liquid composition) Ni sulfate hexahydrate: 50g / dm 3 , Sodium molybdate dihydrate: 60g / dm 3 , Sodium citrate: 90g / dm 3

[0253] (Liquid temperature) 30°C

[0254] (current density) 1~4A / dm 2

[0255] (power-on time) 3 to 25 seconds

[0256]

[0257] An ultra-thin copper layer is formed on the Ni-Mo layer formed in (1). The ultra-thin copper layer was formed on the same conditions as in Example 12 except that the thickness of the ultra-thin copper layer was 2 μm.

Embodiment 14

[0259]

[0260] (1) Ni layer (Ni plating)

[0261] The Ni layer was formed under the same conditions as in Example 12.

[0262] (2) Organic layer (organic layer formation process)

[0263] Next, after washing and pickling the surface of the Ni layer formed in (1), continue under the following conditions to rinse and spray the Ni layer surface for 20 to 120 seconds with a liquid temperature of 40°C and a pH of 5. An aqueous solution, thereby forming an organic layer, the aqueous solution containing carboxybenzotriazole (CBTA) at a concentration of 1 to 30 g / L.

[0264]

[0265] An ultra-thin copper layer is formed on the organic layer formed in (2). The ultra-thin copper layer was formed on the same conditions as in Example 12 except that the thickness of the ultra-thin copper layer was 3 μm.

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Abstract

The present invention relates to a surface-processed copper foil, a copper foil with a carrier, a laminated body, a printed circuit board, an electronic equipment, a manufacturing method for the surface-processed copper foil and a manufacturing method for the printed circuit board. The surface-processed copper foil has good peeling strength and is capable of preventing transmission loss even though it is applied to a high frequency circuit board. The surface-processed copper foil of the present invention sequentially comprises: a copper foil, a metal layer including at least one element selected from a group composed of Ni, Co, Zn, W, Mo and Cr, and a surface-processed layer formed with chrome oxide. The adhesion amount of the elements selected from the group composed of Ni, Co, Zn, W, Mo and Cr in the metal layer is 200-2000[mu]g / dm<2>. After a heat process for 10 minutes under 250 DEG C, if the surface-processed copper foil is soaked in a nitric acid liquid whose concentration is 20 mass% and temperature is 25 DEG C for 30 seconds under a state that only the surface of the surface-processed layer is exposed, the dissolution amount of copper in the nitric acid liquid is less than 0.0030g / 25cm<2>.

Description

technical field [0001] The present invention relates to a surface-treated copper foil, a copper foil with a carrier, a laminate, a printed wiring board, an electronic device, a method for manufacturing a surface-treated copper foil, and a method for manufacturing a printed wiring board. Background technique [0002] From the perspective of ease of wiring and light weight, flexible printed wiring boards (hereinafter referred to as FPCs) are used in small electronic devices such as smartphones and tablet PCs. In addition, in FPC, there is a double-layer flexible printed wiring board as follows: After directly providing a base layer made of metal or metal oxide on an insulator substrate, a double-layer flexible substrate with a copper conductor layer formed is used. The required wiring pattern is formed by a subtractive method or an additive method. [0003] This double-layer flexible printed wiring board widely uses flat rolled copper foil. In recent years, in order to furth...

Claims

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Application Information

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IPC IPC(8): H05K1/09H05K3/38C25D3/38
CPCH05K1/09H05K3/382C25D3/38H05K2201/0355
Inventor 神永贤吾福地亮
Owner JX NIPPON MINING & METALS CO LTD
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