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Treatment copper foil, copper-clad laminate using the treatment copper foil, and print circuit board

A technology of copper clad layer and treatment layer, which is applied in the field of copper foil treatment, can solve the problems of increased transmission loss, longer current propagation distance, etc., and achieves the effect of high peel strength

Active Publication Date: 2016-12-07
FUKUKA METAL FOIL & POWDER CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0043] However, there is a problem of increased transmission loss due to large roughened particles and longer current propagation distance

Method used

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  • Treatment copper foil, copper-clad laminate using the treatment copper foil, and print circuit board
  • Treatment copper foil, copper-clad laminate using the treatment copper foil, and print circuit board
  • Treatment copper foil, copper-clad laminate using the treatment copper foil, and print circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～6

[0122]

[0123] As the electrolytic solution, aqueous solutions prepared to the concentrations, pH values, and liquid temperatures of copper sulfate pentahydrate and pentasodium diethylenetriaminepentaacetate shown in Table 1, respectively, were used. In addition, the pH was adjusted using sulfuric acid.

[0124] In the electrolyte, the titanium coated with the platinum group metal oxide is used as the anode, and the untreated copper foil is used as the cathode for immersion, and the two electrodes are electrolyzed under the electrolysis conditions shown in Table 1. A resin-induced permeation layer is formed on one side of the copper foil.

[0125]

[0126] It is used as an anode in an aqueous solution containing 38g / L of cobalt sulfate heptahydrate, 23g / L of sodium molybdate dihydrate, 45g / L of trisodium citrate dihydrate, and 80g / L of sodium sulfate at pH 5.6 and liquid temperature of 30°C. The surface of titanium is coated with platinum group metal oxide, and the catho...

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PUM

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Abstract

To provide a highly transparent treatment copper foil preferable for a print circuit board, which has excellent transmission characteristics, a high peeling strength with a resin base material, and a low degree of cloudiness (HAZE level) after etching. There is provided a treatment copper foil for a copper-clad laminate, including a roughening treatment layer 2 on at least one surface of an untreated copper foil 1 and an antioxidation treatment layer 3 on the roughening treatment layer 2. The roughening treatment layer 2 is made of fine copper particles with primary particles having diameters of 40nm to 200nm, and the antioxidation treatment layer 3 contains molybdenum and cobalt. The ten point height of irregularities, Rz of the treatment surface to be adhered to an insulating resin base material is 0.5 mum to 1.6 mum, and the color difference delta E*ab between the untreated copper foil 1 and the treatment surface is 45 to 60.

Description

technical field [0001] The present invention relates to a treated copper foil capable of producing excellent transmission characteristics, high peel strength with an insulating resin substrate (hereinafter referred to as "resin substrate"), and a haze of the etched resin substrate. A printed wiring board with low (HAZE value) and high transmittance. Background technique [0002] A printed wiring board used in information communication equipment and the like is a printed wiring board in which a conductive wiring pattern is formed on a resin base material. Examples of the resin substrate include: glass cloth, paper, and other reinforcing materials (reinforcing materials) impregnated with insulating phenolic resins or epoxy resins, polyphenylene ether resins, bismaleimide resins, etc. Resin substrates for rigid printed wiring boards such as amine triazine resins; resin substrates for flexible printed wiring boards made of polyimide resins or cycloolefin polymer resins. On the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/09H05K3/38C25D3/38C25D7/06C25D5/10
Inventor 冈本健真锅久德
Owner FUKUKA METAL FOIL & POWDER CO LTD
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