A kind of bga packaging test socket

Abstract

The invention discloses a BGA package test socket, which comprises a first support part for fixing the BGA package, a plurality of socket pins conducting current, and a second support part for fixing the socket pins; the first support part is fixedly installed on On the second supporting part, the BGA package is located above the socket pin; the first supporting part includes a square frame fixedly installed on the second supporting part, and a plurality of pressing devices installed in the four side walls of the square frame . The pressing device includes a lateral movement module and a pressing module; in actual operation, the pressing parts in the plurality of pressing devices distributed on the four side walls of the square frame are evenly pressed around the BGA package, so that the BGA package The lower surface is in tight contact with the socket pins. Through the above technical solution, the BGA package and the side wall of the square frame can be fitted with a gap, so that it is convenient for workers to pick and place the BGA package, so as to improve the efficiency of package testing.

Description

Technical field: [0001] The invention relates to a chip test tool, in particular to a BGA package test socket. Background technique: [0002] Semiconductor components are processed into semiconductor chip packages through a series of packaging processes. The processed semiconductor chip package must go through an electrical inspection project before being provided to the user; in the above-mentioned electrical inspection project, the electrical characteristics of the semiconductor chip package are checked by using a test socket. Here, the test socket is a device that electrically connects the direct loop of each semiconductor component to the test instrument. [0003] The pressurized packaging test socket in the prior art is composed of an upper cover, a side support, a lower chassis, fixing screws, a fixing plate, a pressure plate, and socket pins. During actual operation, firstly, the fixed disk on which the socket pins are fixed is connected to the lower chassis through...

AI Technical Summary

Problems solved by technology

[0006] The technical problem solved by the present invention: in the decompression type packaging test socket in the prior art, the space between the socket pin and the package must be a closed space, so that the decompression device can lower the pressure between the socket pin and the package than the above-mentioned package. Test the external pressure of the socket, which requires the contact between the side wall of the package and the inner wall of the socket to be in close contact. In this way, the requirements for the cooperation between the package and the socket are too high, which is not conducive to the effective implementation of the package test, and is also not conducive to Improvement of Package Test Efficiency

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