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Wiring substrate and electronic device

A technology for wiring substrates and wiring conductors, applied in circuits, printed circuits, electrical components, etc., can solve problems such as abnormality, disconnection resistance, abnormality, etc., and achieve the effect of improving electrical reliability, electrical characteristics, and good light emission

Active Publication Date: 2018-02-06
KYOCERA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, when the insulating base constituting the wiring board is made of ceramics, when the ceramic green sheet laminate is stacked and pressed during the production of the wiring board, for example, there is a central portion of the notch in a top view. If it is deformed so as to protrude toward the inner side of the notch, disconnection or abnormal resistance will occur between the wiring conductor and the electrode. When the electronic component is a light-emitting device, there is a possibility that it will not be a device that normally emits light.

Method used

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  • Wiring substrate and electronic device
  • Wiring substrate and electronic device
  • Wiring substrate and electronic device

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no. 1 Embodiment approach

[0026] The electronic device in the first embodiment of the present invention such as figure 1 as well as figure 2 As shown, the wiring board 1 and the electronic component 2 provided on the upper surface of the wiring board 1 are included. The electronic device is mounted, for example, on a circuit board constituting an electronic component module.

[0027] The wiring substrate 1 includes: an insulating base 11 having a side surface including a notch 12; an electrode 13 provided on the inner surface of the notch 12; 15. The width of the notch 12 is larger than the depth, and the connecting conductor 14 is connected to the electrode 13 at the end of the notch 12 in the width direction. exist Figure 1 to Figure 4 and the following Figure 5 ~ Figure 8 In , the electronic device is installed on the xy plane in the imaginary xyz space. exist Figure 1 to Figure 4 and the following Figure 5 ~ Figure 8 In , the upward direction refers to the positive direction of the ima...

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Abstract

The wiring board (1) of the present invention includes: an insulating base (11) having a side surface including a cutout (12); an electrode (13) provided on the inner surface of the cutout (12); Inside or surface, the wiring conductor (15) connected to the electrode (13) via the connecting conductor (14), the width of the cutout (12) is greater than the depth, and the connecting conductor (14) is at the end of the cutout (12) in the width direction Connect to electrode (13). Moreover, the electronic device of this invention is provided with the above-mentioned wiring board (1); and the electronic component (2) mounted on the upper surface of this wiring board (1).

Description

technical field [0001] The present invention relates to a wiring board and an electronic device. Background technique [0002] Conventionally, in a wiring board, a wiring conductor is provided inside or on the surface of an insulating base, and a notch is provided from the side surface to the lower surface of the insulating base, and an electrode connected to the wiring conductor is provided on the inner surface. When joining an electronic device including such a wiring board to an external circuit board, electrodes of the wiring board are joined to electrode pads and the like of the external circuit board via solder. [0003] prior art literature [0004] patent documents [0005] Patent Document 1: JP Unexamined Patent Publication No. 5-183066 [0006] Summary of the invention [0007] The problem to be solved by the invention [0008] In recent years, the miniaturization of electronic devices has been promoted, but in order to suppress the decrease in the bonding str...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/11H01L23/13
CPCH01L2224/16225H01L2224/48227H05K3/403H05K2201/09036H01L33/62H05K3/4629H05K2201/09145H05K2201/0969H01L23/49805H01L2924/181H01L23/13H01L23/49838H01L2924/00012H01L23/49811H01L24/05
Inventor 村上健策
Owner KYOCERA CORP