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An aircraft ground thermal simulation test device capable of rapid cooling

A test device and aircraft technology, which is applied in the field of aircraft ground thermal simulation test devices, can solve the problems of few reports on cooling simulation devices, and cannot meet the test requirements of the cooling process, so as to prevent thermal deformation, ensure long-term use, and realize PID control. Effect

Inactive Publication Date: 2017-09-12
XI AN JIAOTONG UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, most of the thermal simulation test devices at home and abroad are for aerodynamic heating process simulation. For example, infrared radiation heaters or graphite heaters are used as heat sources to simulate aerodynamic heating heat flow and test the specific performance of materials and components under the action of aerodynamic heat, which cannot meet the cooling requirements. The test requirements for process simulation, and there are few reports of similar cooling simulation devices in the literature

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  • An aircraft ground thermal simulation test device capable of rapid cooling
  • An aircraft ground thermal simulation test device capable of rapid cooling
  • An aircraft ground thermal simulation test device capable of rapid cooling

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Embodiment Construction

[0048] The present invention is to adapt to the new requirements of the ground thermal simulation test, and provides a test device capable of simulating the rapid cooling process, in order to connect the cooling simulation and heating simulation, meet the rapid cooling requirements of test pieces of different sizes and materials, and provide Different cooling rates to achieve controlled zoned cooling of large-sized test pieces. The present invention will be further described in detail below in conjunction with specific embodiments, which are explanations of the present invention rather than limitations.

[0049] see figure 1 , an aircraft ground thermal simulation test device that can rapidly cool down, the device includes a compressed air system A, a water / liquid nitrogen supply system B, a first test piece heating-cooling test platform C, a second test piece heating-cooling test platform D and data acquisition and control system E;

[0050] The compressed air system A prov...

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Abstract

The invention discloses a ground thermal simulation test device for an aircraft that can rapidly cool down. The device includes a compressed air system (A), a water / liquid nitrogen supply system (B), a first test piece heating-cooling test platform (C), The second test piece heating-cooling test platform (D) and data acquisition and control system (E). The present invention effectively integrates the heating and cooling systems of the aircraft, and on the heating-cooling test platform, the position of the test piece is switched between the heating end and the cooling end through a linear slide rail, and after the test piece reaches a predetermined temperature, it moves along the track And trigger the travel switch to release the cooling working medium, realize the rapid start of cooling, and effectively connect the heating and cooling simulation test process; it can meet the urgent needs of developing new high-speed aircraft and ensuring its flight safety, and perfect the ground thermal simulation test method.

Description

technical field [0001] The invention belongs to the technical field of high-speed aircraft thermal simulation, and relates to an aircraft ground thermal simulation test device capable of rapid cooling. Background technique [0002] The increase in the flight speed of high-speed aircraft (especially hypersonic aircraft) deteriorates the thermal environment faced by the aircraft, which will generate severe aerodynamic heating during flight, and the surface temperature of the body will rise to over 1000°C under the action of aerodynamic heating , and due to the deceleration of the aircraft and other factors during the flight, the high-temperature surface may experience a rapid cooling process. The rapid cooling of the high-temperature surface will cause excessive thermal stress, seal failure, structural deformation and damage, and seriously affect the safety and normal flight of the aircraft. For some components and materials, it is necessary to simulate their rapid cooling pr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N25/20
CPCG01N25/20
Inventor 何雅玲文哲希严超曹学伟
Owner XI AN JIAOTONG UNIV