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Side-wettable package unit and manufacturing method thereof

A manufacturing method and package technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., can solve the problems of easy-off reliability and insufficient reliability, so as to avoid delamination, improve reliability, and enhance bonding strength Effect

Active Publication Date: 2016-03-02
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when the package unit of the quad flat no-lead (QFN) package is mounted on a substrate or a circuit board, it is easy to fall off and has a problem of insufficient reliability.

Method used

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  • Side-wettable package unit and manufacturing method thereof
  • Side-wettable package unit and manufacturing method thereof
  • Side-wettable package unit and manufacturing method thereof

Examples

Experimental program
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Embodiment Construction

[0017] In order to make the above objects, features and advantages of the present invention more comprehensible, preferred embodiments of the present invention are exemplified below and described in detail in conjunction with the accompanying drawings. Furthermore, the directional terms mentioned in the present invention, such as "up", "down", "top", "bottom", "front", "back", "left", "right", "inside", " Outer, Side, Surround, Center, Horizontal, Horizontal, Vertical, Longitudinal, Axial, Radial, Topmost, or Bottommost etc. are merely for reference to the directions of the attached drawings. Therefore, the directional terms used are used to illustrate and understand the present invention, but not to limit the present invention.

[0018] Please refer to Figure 1A , which depicts a cross-sectional view of a packaging unit according to an embodiment of the present invention. The packaging unit 10 includes a base 11 , pins 12 , metal layers 13 , components 14 , bonding wires 1...

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PUM

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Abstract

The invention discloses a semiconductor package unit and a manufacturing method thereof. The package unit comprises the components of a base; pins which are adjacent to the base and respectively comprise a base part and an extending part, wherein the extending part from the side, which is far from the side of the base, of the base part, and furthermore the upper surface of the extending part is higher than the upper surface of the base part; an element which is arranged at the upper surface of the base; welding lines which connect the element with the pins; a packaging member which packages the element, the welding lines, the base and the pin, wherein the side of the packaging member is level with the side of the extending part, and furthermore the lower surface of the base, the lower surface of the base part and the side, which is far from the base, of the base part are all exposed; and metal layers which are at least arranged on the exposed lower surface of the base, the exposed lower surface of the base part and the exposed side surface, which is far from the base, of the base part.

Description

technical field [0001] The present invention relates to a semiconductor packaging unit and its manufacturing method, and in particular to a packaging unit with extending parts for pins and its manufacturing method. Background technique [0002] The present invention relates to a quad flat package (Quad Flat Package, QFP), and in particular to a quad flat non-leaded package (Quad Flat Non-leaded package, QFN package). Semiconductor packaging technology includes many packaging forms. Recently, with the miniaturization of electronic products and the increase in the number of input / output (I / O), the quadrilateral flat no-lead package belonging to the quadrilateral flat package series has a shorter Signal transmission path and relatively fast signal transmission speed, so it is suitable for high-frequency transmission chip packaging. [0003] The package unit of the quad flat no-lead (QFN) package is cut by a blade, so the sides of the leads are exposed, and then a metal layer i...

Claims

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Application Information

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IPC IPC(8): H01L23/495H01L23/31H01L21/50H01L21/56
CPCH01L2224/48091H01L2224/48247H01L2224/97H01L2924/181H01L2924/00014H01L2924/00012
Inventor 康成国
Owner ADVANCED SEMICON ENG INC