Statistical process control method for processing wafers in batch
A technology of statistical process control and batch processing, which is applied in the field of statistical process control of wafer processing and quality improvement of wafer batch processing, which can solve the problems of complex second-order nesting, false alarms, and improvement.
Active Publication Date: 2016-03-23
CHENGDU RDW TECH CO LTD
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Problems solved by technology
In this way, the sample data collected during the production process of batch processing wafers no longer obey the independent and same normal distribution, so if the traditional control chart is still used, a large number of false alarms will be generated
At the same time, the problem of second-order nesting is more complicated, so the traditional control chart cannot fully monitor all aspects that need to be monitored for batch processing wafers, and cannot achieve the improvement of batch processing wafer quality
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[0052] The present invention will be further described below by taking the batch processing of wafers for making 3AQ151024 integrated circuit chips as an example in conjunction with the accompanying drawings.
[0053] refer to figure 1 , the implementation steps of the present invention are as follows:
[0054] Step 1: Collect a sample.
[0055] 1.1) The wafer of the 3AQ151024 integrated circuit chip is placed in a diffusion furnace numbered 11C for batch phosphorus diffusion;
[0056] 1.2) After phosphorus diffusion, first select such as figure 2 3 wafers are extracted from the 3 fixed positions shown; then the sheet resistance is measured at 5 fixed positions on the extracted wafer for sample data collection, as shown in image 3 shown;
[0057] 1.3) 25 batches of sample data are obtained after 25 consecutive collections, each batch has 3 sub-batches, and each sub-batch has 5 sample data, as shown in Table 1, record the l-th sample data of the j-th sub-batch of the i-th b...
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The invention discloses a statistical process control method for processing wafers in batch, which mainly solves the problem that the existing control chart cannot control the statistical process of wafers processed in batch. The method comprises the following steps: 1, when the same product accomplishes batch processing of wafers in a corresponding processing furnace, acquiring sample data to obtain the mean and the standard deviation of each sub batch; 2, calculating corresponding feature values of four control charts in a two-order nested control chart according to the mean and the standard deviation of each sub batch to obtain control lines of the four control charts in the two-order nested control chart; 3, drawing the feature values and the control lines to the corresponding control charts according to a drawing method of a Shewhart control chart; and 4, judging the four control charts in step 3 by using judging process abnormity criteria to obtain a result whether the production process of wafers processed in batch is in a controlled state or not. The method can be used for comprehensively monitoring batch processing of wafers, has a diagnosis function, improves the processing quality of wafers, and can be used for batch production of wafers.
Description
technical field [0001] The invention belongs to the technical field of semiconductors, in particular to a statistical process control method for wafer processing, which can be used for quality improvement of wafer batch processing. Background technique [0002] "Statistical Process Control" is one of the most popular and effective quality improvement methods today. Statistical process control technology mainly refers to the use of Shewhart's process control theory, that is, the control chart to monitor the various stages of the product in the production process, that is, the quality characteristics of the process, and analyze the trend of the quality characteristics according to the point distribution on the control chart. Preventive measures to ensure that the production process is in a state of statistical control, so as to achieve the purpose of improving and ensuring quality. However, the premise of applying the traditional control chart is that the sample data of each ...
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IPC IPC(8): G05B19/418
CPCY02P90/02G05B19/41875
Inventor 游海龙田文星顾凯贾新章
Owner CHENGDU RDW TECH CO LTD