Infrared sensor and packaging structure thereof and preparation method thereof

Abstract

The invention provides an infrared sensor and packaging structure thereof and a preparation method thereof. The infrared sensor and packaging structure thereof comprises a reading circuit substrate for collecting and processing output signals of infrared sensors; an infrared sensor unit comprising a part of pixels in an infrared sensor array and used for converting infrared radiation incident to the infrared sensor unit into electrical signals, which are output by the reading circuit substrate; and a vacuum micro-cavity structure for packaging the infrared sensor unit in the vacuum environment of an inner region thereof. The vacuum micro-cavity structure comprises a support housing having a release channel, an infrared antireflection film arranged on the upper surface of the support housing and for blocking the release channel, and a getter film arranged inside the vacuum micro-cavity structure. According to the scheme, pixel-level packaging of the infrared sensors can be realized, absorption efficiency of the infrared sensors for the infrared radiation can be increased, and sensitivity of the infrared sensors is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to an infrared sensor and its packaging structure, and a method for preparing the infrared sensor and its packaging structure. Background technique [0002] In the prior art, when the infrared sensor is packaged, a bonding process is used to seal the entire infrared sensor array in a package composed of a ceramic or metal shell and an infrared window in a vacuum environment, such as figure 1 shown in . At present, the commonly used packaging technologies are device-level packaging and multi-chip batch packaging technologies. However, these packaging technologies have low infrared transmittance, complex processes, high costs, and low production capacity. Moreover, the bonding process requires special equipment and process, which is difficult and costly, and is incompatible with standard integrated circuit processing and integrated circuit packaging processes. Contents of th...

AI Technical Summary

Problems solved by technology

At present, the commonly used packaging technologies are device-level packaging and multi-chip batch packaging technologies. However, these packaging technologies have low infrared transmittance, complex processes, high costs, and low production capacity. Moreover, the bonding process requires special equipment and process, which is difficult, expensive, and incompatible with standard integrated circuit processing and integrated circuit packaging processes

Images