Power module

Abstract

The invention discloses a power module. The power module comprises a positive electrode, a negative electrode, an output electrode, an upper bridge arm set, a lower bridge arm set and a transitional copper layer. The lower bridge arm set comprises a lower bridge arm chip copper layer, a lower bridge arm wiring copper layer and a lower bridge arm chip unit installed on the lower bridge arm chip copper layer. The lower bridge arm wiring copper layer is located between the lower bridge arm chip copper layer and the transitional copper layer. The lower bridge arm chip unit is connected to the lower bridge arm wiring copper layer through a bonding wire. In the invention, through changing a distribution structure of the copper layers, a current path is changed and the lower bridge arm chip copper layer, the lower bridge arm wiring copper layer and the transitional copper layer which are adjacently arranged are cooperated with each other so that a follow current loop area of a working current and a freewheel current is reduced; a stray inductance, switch losses and a circuit complexity are decreased; module reliability is increased and the power module can be applied in the high speed power module field.

Description

technical field [0001] The invention relates to the field of power electronics, in particular to a power module. Background technique [0002] The power module is a power switch module packaged by power electronic devices such as MOS tube (metal oxide semiconductor), IGBT (insulated gate field effect transistor), and FRD (fast recovery diode) according to certain functions. Power conversion in various occasions such as automobiles, photovoltaic power generation, wind power generation, and industrial frequency conversion. [0003] However, as the power switch in the module is repeatedly switched, the inductance generated by its structural configuration can reduce the reliability of the power module. Due to the large area of ​​the freewheeling circuit of ordinary power modules, the inductance of the freewheeling circuit of the module is very large, resulting in large switching losses and low reliability of the module under high current conditions. Contents of the invention ...

AI Technical Summary

Problems solved by technology

[0003] However, as the power switch in the module is switched repeatedly, the inductance generated by its structural configuration will reduce the reliability of the power module

Due to the large area of ​​the freewheeling circuit of ordinary power modules, the inductance of the freewheeling circuit of the module is very large, resulting in large switching losses and low reliability of the module under high current conditions.

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