Power module

Abstract

The invention discloses a power module. The power module comprises a bottom plate, a positive electrode, a negative electrode, an output electrode and an insulating substrate arranged on the bottom plate; an insulating layer is arranged between the positive electrode, the negative electrode and the output electrode, and the bottom plate separately; the insulating substrate comprises a thermal conducting insulating layer and copper layers formed in the thermal conducting insulating layer; a plurality of mutually-independent annular insulating grooves are formed in the copper layers of the insulating substrate; the copper layer surrounded by each insulating groove is a lower bridge arm copper layer; the copper layer on the outer side of the insulating grooves is an upper bridge arm copper layer; the upper bridge arm copper layer is provided with an upper bridge arm chip unit; the lower bridge arm copper layer is provided with a lower bridge arm chip unit; a wiring region is formed in one end, close to the positive electrode, of the upper bridge arm copper layer; a lower bridge arm source electrode line bank is arranged between the wiring region and the lower bridge arm copper layer; and the lower bridge arm source electrode line bank comprises a line bank heat conducting insulating layer and a line bank copper layer formed on the line bank heat conducting insulating layer. According to the power module, the follow current loop area is reduced, the stray inductance and the switch loss are lowered, and the reliability of the power module is improved.

Description

technical field [0001] The invention relates to the field of power electronics, in particular to a power module. Background technique [0002] The power module is a power switch module packaged by power electronic power devices such as MOS tube (metal oxide semiconductor), IGBT (insulated gate field effect transistor), and FRD (fast recovery diode) according to certain functions. Power conversion in various occasions such as automobiles, photovoltaic power generation, wind power generation, and industrial frequency conversion. [0003] However, as the power switch in the module is repeatedly switched, the inductance generated by its structural configuration can reduce the reliability of the power module. Due to the large area of ​​the freewheeling circuit of the traditional power module, the inductance of the freewheeling circuit of the module is large, which leads to large switching loss and low reliability of the module. Contents of the invention [0004] Purpose of th...

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Problems solved by technology

[0003] However, as the power switch in the module is switched repeatedly, the inductance generated by its structural configuration will reduce the reliability of the power module

Due to the large area of ​​the freewheeling circuit of the traditional power module, the inductance of the freewheeling circuit of the module is large, which causes the switching loss of the module to be large and the reliability is low

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