a power module

Abstract

A power module disclosed by the present invention comprises a base plate, a positive electrode, a negative electrode, an output electrode and an insulating substrate arranged on the base plate, an insulating layer is provided between the positive electrode, the negative electrode, the output electrode and the base plate, and the insulating base plate includes The thermally conductive insulating layer and the copper layer formed on the thermally conductive insulating layer, the copper layer of the insulating substrate is provided with a plurality of mutually independent annular insulating grooves, the copper layer surrounded by each insulating groove is the copper layer of the lower bridge arm, and the insulating groove The outer copper layer is the copper layer of the upper bridge arm, the upper bridge arm chip unit is arranged on the upper bridge arm copper layer, and the lower bridge arm chip unit is arranged on the lower bridge arm copper layer; the upper bridge arm copper layer is at the end close to the positive electrode A wiring area is provided, and a lower bridge arm source wiring bar is provided between the wiring area and the copper layer of the lower bridge arm. The lower bridge arm source wiring bar includes a wiring bar heat-conducting insulating layer and a wiring bar formed on the wiring bar heat-conducting insulating layer. Copper layer; the invention reduces the freewheeling circuit area, reduces stray inductance and switching loss, and improves the reliability of the module.

Description

technical field [0001] The invention relates to the field of power electronics, in particular to a power module. Background technique [0002] The power module is a power switch module packaged by power electronic power devices such as MOS tube (metal oxide semiconductor), IGBT (insulated gate field effect transistor), and FRD (fast recovery diode) according to certain functions. Power conversion in various occasions such as automobiles, photovoltaic power generation, wind power generation, and industrial frequency conversion. [0003] However, as the power switch in the module is repeatedly switched, the inductance generated by its structural configuration can reduce the reliability of the power module. Due to the large area of ​​the freewheeling circuit of the traditional power module, the inductance of the freewheeling circuit of the module is large, which leads to large switching loss and low reliability of the module. Contents of the invention [0004] Purpose of th...

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Problems solved by technology

[0003] However, as the power switch in the module is switched repeatedly, the inductance generated by its structural configuration will reduce the reliability of the power module

Due to the large area of ​​the freewheeling circuit of the traditional power module, the inductance of the freewheeling circuit of the module is large, which causes the switching loss of the module to be large and the reliability is low

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