Thin film material structure for InSb magnetic-sensitive device and manufacturing process
A thin-film material and manufacturing process technology, applied in the field of thin-film material structure and manufacturing process, can solve the problems of incomplete ceramic structure, deterioration of thin-film electrical properties, great difference in thermal expansion coefficient, etc., to achieve the effect of ensuring electrical properties
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[0027] Preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art.
[0028] Refer to attached figure 2 , the thin film material structure used in the InSb magnetic sensitive device in this embodiment, it includes the substrate layer 1, the transition layer 2, the insulating layer 3, and the thin film layer 4 arranged in sequence from bottom to top.
[0029] The material of the substrate layer 1 is ceramics, silicon, ferrite or mica. The thickness is 100 μm to 1000 μm.
[0030] The material of the transition layer 2 is a compound containing at least one metal element of the same group as In including In. Preferably, the compound contains at least Sb. More preferably, the compound only contains metal elements in the group of In except Sb. If in the thin film material manufacturing ...
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Abstract
Description
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