Unlock instant, AI-driven research and patent intelligence for your innovation.

Thin film material structure for InSb magnetic-sensitive device and manufacturing process

A thin-film material and manufacturing process technology, applied in the field of thin-film material structure and manufacturing process, can solve the problems of incomplete ceramic structure, deterioration of thin-film electrical properties, great difference in thermal expansion coefficient, etc., to achieve the effect of ensuring electrical properties

Inactive Publication Date: 2016-04-06
JIANGSU SENTRONIC ELECTRONICS TECH INC
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The film material structure used for InSb magnetic sensitive devices in the prior art is to directly evaporate and grow the InSb film layer on the substrate layer, which has the following defects: 1. InSb The thermal stress of the film will be generated after the change of heat and cold, and the thermal expansion coefficient of InSb and the material used in the substrate layer are very different, so the quality of the InSb film will be damaged when the heat is changed; 2. The impurities in the substrate material directly grow on the The above InSb has a doping effect, which makes the electrical properties of the film worse; 3. In the prior art, ceramics are a commonly used material for the substrate layer, but the ceramic structure is incomplete, and there are many tiny holes on it, so it is directly grown on The above InSb film will also be affected by it and holes will appear

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Thin film material structure for InSb magnetic-sensitive device and manufacturing process
  • Thin film material structure for InSb magnetic-sensitive device and manufacturing process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] Preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art.

[0028] Refer to attached figure 2 , the thin film material structure used in the InSb magnetic sensitive device in this embodiment, it includes the substrate layer 1, the transition layer 2, the insulating layer 3, and the thin film layer 4 arranged in sequence from bottom to top.

[0029] The material of the substrate layer 1 is ceramics, silicon, ferrite or mica. The thickness is 100 μm to 1000 μm.

[0030] The material of the transition layer 2 is a compound containing at least one metal element of the same group as In including In. Preferably, the compound contains at least Sb. More preferably, the compound only contains metal elements in the group of In except Sb. If in the thin film material manufacturing ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a thin film material structure for an InSb magnetic-sensitive device and a manufacturing process. A doping effect is shielded through a transition layer, and the electrical property of a thin film layer is ensured; the transition layer is selected from the same material as the thin film layer; the difference between the coefficients of thermal expansion of the transition layer and the thin film layer is quite low, so that the influence on the thin film layer caused by the difference of the coefficients of thermal expansion is reduced; when a ceramic material is selected as a substrate layer material, the influence on the thin film layer caused by voids in the ceramic is avoided due to the transition layer; and the transition layer and the thin film layer are both conductive layers, and an insulating layer is added between the transition layer and the thin film layer for performing an insulating function.

Description

technical field [0001] The invention relates to a thin film material structure and a manufacturing process for an InSb magnetic sensitive device. Background technique [0002] The thin film material structure that is used for InSb magnetosensitive device in the prior art is to directly evaporate and grow the InSb film layer on the substrate layer, which has the following defects: 1. Thermal stress will be generated after the InSb film is changed by cold and heat, and InSb and substrate The thermal expansion coefficient of the material used in the bottom layer is very different, which will damage the quality of the InSb film when the temperature changes; 2. The impurities in the substrate material have a doping effect on the InSb directly grown on it, so that the electrical properties of the film change. Poor; 3. In the prior art, ceramics are a commonly used material for the substrate layer, but the ceramic structure is incomplete, and there are many tiny holes on it, so the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L43/00H01L43/10H01L43/12H10N50/01
CPCH10N50/00H10N50/01H10N50/85
Inventor 马可军俞振中郑律
Owner JIANGSU SENTRONIC ELECTRONICS TECH INC